Press-fit terminal connection structure having types of alloy layer

Patent metadata

Field	Value
Publication number	US-10594062-B2
Application number	US-201716300340-A
Country	US
Kind code	B2
Filing date	May 11, 2017
Priority date	May 19, 2016
Publication date	Mar 17, 2020
Grant date	Mar 17, 2020

Abstract

It is aimed to provide a press-fit terminal connection structure in which a board connecting portion of a press-fit terminal is press-fit into a through hole provided in a printed circuit board and which can combine the suppression of scraping of a surface layer and a reduction of a necessary load when the press-fit terminal is inserted into and withdrawn from the through hole and an improvement of a holding force for keeping the press-fit terminal inserted in the through hole. In the press-fit terminal connection structure, the press-fit terminal includes, at least on a surface of the contact point portion, an alloy containing layer mainly containing tin and palladium, and the through hole includes a tin layer on an outermost surface of an inner peripheral surface including at least the contact point portion.

First claim

The invention claimed is:

1. A press-fit terminal connection system comprising:
a printed circuit board having a through hole, the through hole including a tin layer on an outermost surface of an inner peripheral surface and at least a contact point portion on the tin layer; and
a press-fit terminal having a board connecting portion configured to be press-fit into the through hole of the printed circuit board such that the through hole and the press-fit terminal are electrically in contact at a contact point portion of the press-fit terminal and the contact point portion on the tin layer of the through hole, the press-fit terminal including:
an alloy containing layer having a domain structure of alloy parts and tin parts, the alloy parts being made of an alloy mainly containing tin and palladium, and the tin parts are made of pure tin or an alloy having a higher ratio of tin to palladium than the alloy parts, both the alloy parts and the tin parts being exposed on an outermost surface of the press-fit terminal;
a base; and
a nickel under layer disposed between the alloy containing layer and the base, the nickel under layer being composed of a nickel-tin alloy layer and a pure nickel layer, the nickel-tin alloy layer being disposed between the alloy containing layer and the nickel layer, and the nickel layer being disposed between the nickel-tin alloy layer and the base, wherein:
a content of palladium in the alloy containing layer is 2 atomic % or higher; and
a surface hardness of the alloy containing layer is 120 Hv or greater and 380 Hv or less.

2. The press-fit terminal connection system according to claim 1 , wherein a layer of contact oil is not on respective surfaces of the contact point portions of the press-fit terminal and on the tin layer of the through hole.

3. The press-fit terminal connection system according to claim 1 , wherein a maximum value of a friction coefficient between the tin layer of the through hole and the contact point portion of the press-fit terminal covered with the alloy containing layer is larger when the press-fit terminal is withdrawn from the through hole than when the press-fit terminal is inserted into the through hole.

4. The press-fit terminal connection system according to claim 1 , wherein a difference between a maximum static friction coefficient and a dynamic friction coefficient between the tin layer of the through hole and the contact point portion of the press-fit terminal covered with the alloy containing layer is 0.06 or greater.

5. The press-fit terminal connection system according to claim 1 , wherein a maximum static friction coefficient between the tin layer of the through hole and the contact point portion of the press-fit terminal covered with the alloy containing layer is 0.4 or greater.

6. The press-fit terminal connection system according to claim 1 , wherein a dynamic friction coefficient between the tin layer of the through hole and the contact point portion of the press-fit terminal covered with the alloy containing layer is less than 0.4.

7. The press-fit terminal connection system according to claim 1 , wherein the content of palladium in the alloy containing layer is 3 atomic % or greater.

8. A press-fit terminal connection system comprising:
a printed circuit board having a through hole, the through hole including:
a tin layer on an outermost surface of an inner peripheral surface,
a base on an innermost layer of the inner peripheral surface,
a copper under layer in between the tin layer and the base, and
at least a contact portion on the tin layer; and

a press-fit terminal having a board connecting portion configured to be press-fit into the through hole of the printed circuit board such that the through hole and the press-fit terminal are electrically in contact at a contact point portion of the press-fit terminal and the contact point portion on the tin layer of the through hole, wherein:
the press-fit terminal includes an alloy containing layer having a domain structure of alloy parts and tin parts, the alloy parts being made of an alloy mainly containing tin and palladium, and the tin parts are made of pure tin or an alloy having a higher ratio of tin to palladium than the alloy parts, both the alloy parts and the tin parts being exposed on an outermost surface of the press-fit terminal,
a content of palladium in the alloy containing layer is 2 atomic % or higher; and
a surface hardness of the alloy containing layer is 120 Hv or greater and 380 Hv or less.

9. The press-fit terminal connection system according to claim 8 , wherein a layer of contact oil is not on respective surfaces of the contact point portions of the press-fit terminal and the through hole.

10. The press-fit terminal connection system according to claim 8 , wherein a maximum value of a friction coefficient between the tin layer of the through hole and the contact point portion of the press-fit terminal covered with the alloy containing layer is larger when the press-fit terminal is withdrawn from the through hole than when the press-fit terminal is inserted into the through hole.

11. The press-fit terminal connection system according to claim 8 , wherein a difference between a maximum static friction coefficient and a dynamic friction coefficient between the tin layer of the through hole and the contact point portion of the press-fit terminal covered with the alloy containing layer is 0.06 or larger.

12. The press-fit terminal connection system according to claim 8 ,
wherein a maximum static friction coefficient between the tin layer of the through hole and the contact point portion of the press-fit terminal covered with the alloy containing layer is 0.4 or larger.

13. The press-fit terminal connection system according to claim 8 , wherein a dynamic friction coefficient between the tin layer of the through hole and the contact point portion of the press-fit terminal covered with the alloy containing layer is below 0.4.

14. The press-fit terminal connection system according to claim 8 , wherein the content of palladium in the alloy containing layer is 3 atomic % or higher.

15. The press-fit terminal connection system according to claim 8 , wherein an underlayer made of nickel or nickel alloy is provided between the base material constituting the press-fit terminal and the alloy containing layer.

Assignees

• Autonetworks Technologies Ltd
• Sumitomo Wiring Systems
• Sumitomo Electric Industries

Inventors

• Shirai Yoshimasa
• Saitoh Yasushi
• Furukawa Kingo
• Kawasaki Tetsuhiko
• Ookubo Masayuki
• Watanabe Hajime
• Tsuchiya Yoshiyasu
• Kato Akihiro

Classifications

• H05K2201/1059

  Connections made by press-fit insertion · CPC title

• H01R13/035

  Plated dielectric material · CPC title

• C25D5/12 Primary

  at least one layer being of nickel or chromium · CPC title

• H01R12/585 Primary

  Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board · CPC title

• C25D7/00

  Electroplating characterised by the article coated · CPC title