System for applying interface materials

Patent metadata

Field	Value
Publication number	US-11014203-B2
Application number	US-201615207444-A
Country	US
Kind code	B2
Filing date	Jul 11, 2016
Priority date	Jul 11, 2016
Publication date	May 25, 2021
Grant date	May 25, 2021

Abstract

A system for applying thermal interface materials to components includes a supply of thermal interface material and a die. The die is operable for pushing against and/or removing a portion of the thermal interface material that is between the die and a corresponding one of the components. The portion of the thermal interface material is removed from the supply and applied to the corresponding one of the components.

First claim

What is claimed is:

1. A system for applying thermal interface materials to components, the system comprising:
a supply of thermal interface material having a high thermal conductivity; and
a die operable for both tamping and cutting a portion of the thermal interface material from the supply that is between the die and a corresponding one of the components, whereby the portion of the thermal interface material is removed from the supply and applied as a conformable thermal pad to the corresponding one of the components without diffusion bonding of the portion of the thermal interface material to the corresponding one of the components, without welded joints between the portion of the thermal interface material and the corresponding one of the components, and without trapped air within the conformable thermal pad.

2. The system of claim 1 , wherein the supply of thermal interface material comprises a supply of non-metal thermal interface material having a thermal conductivity of at least 1 Watt per meter per Kelvin, and wherein a portion of the non-metal thermal interface material is applied as the conformable thermal pad to the corresponding one of the components without adhesive between the portion of the non-metal thermal interface material and the corresponding one of the components.

3. The system of claim 1 , wherein:
the supply of thermal interface material further includes a liner along a surface of the thermal interface material; and
the die is movable downwardly through the liner such that the downward movement of the die through the liner also moves and applies the portion of the thermal interface material from the liner downwardly onto the corresponding one of the components without cutting or transferring the liner from the supply and reduces a thickness of the portion of the thermal interface material.

4. The system of claim 3 , wherein the die is operable for pushing the liner downwardly through the portion of the thermal interface material for downwardly severing the portion of the thermal interface material from the supply without cutting the liner and thereby transferring the portion of the thermal interface material from the liner onto the corresponding one of the components without having to puncture the liner, and wherein the die is operable for forcing the liner down into the portion of the thermal interface material such that the thickness of the portion of the thermal interface material is reduced or pushed out of the way, thereby providing the portion of the thermal interface material with tapered edges in a thickness dimension along all sides of the portion of the thermal interface material that has been transferred to the corresponding one of the components.

5. The system of claim 3 , wherein the system is configured such that the portion of the thermal interface material remains on the corresponding one of the components and such that a corresponding portion of the liner is automatically removed by the die from the portion of the thermal interface material transferred onto the corresponding one of the components and remains with an unused salvage portion of the supply when the die is removed and moved relatively away from the portion of the thermal interface material.

6. The system of claim 1 , wherein the system comprises a sensor system to advance the supply of thermal interface material for a next application of another portion of the thermal interface material to a subsequent component of the components after the system has applied the portion of the thermal interface material to the corresponding one of the components.

7. The system of claim 1 , wherein the system includes the components that comprise:
integrated heat spreaders of integrated circuit packages comprising thermally-conductive metal lids configured to rest on top of central processing units or processor dies; or
lids of board level shields including sidewalls, the lids being integral with or removably attachable to the sidewalls of the board level shields, whereby each said board level shield is configured such that when the sidewalls are installed to a substrate about at least one component and the lid is covering an opening defined by the sidewalls, the portion of the thermal interface material applied to the lid cooperates with the lid to define a thermally-conductive heat path from the at least one component and the board level shield is operable for providing electromagnetic interference (EMI) shielding for the at least one component.

8. The system of claim 1 , wherein the supply of thermal interface material is a supply of thermal phase change material having a thermal conductivity of at least 1 Watt per meter per Kelvin, and wherein the system includes the components that comprise lids of board level shields including sidewalls, the lids being integral with or removably attachable to the sidewalls of the board level shields, whereby each said board level shield is configured such that when the sidewalls are installed to a substrate about at least one component and the lid is covering an opening defined by the sidewalls, a portion of the thermal phase change material applied to the lid cooperates with the lid to define a thermally-conductive heat path from the at least one component and the board level shield is operable for providing electromagnetic interference (EMI) shielding for the at least one component.

9. The system of claim 1 , wherein the system is configured to be operable for applying multiple different thermal interface materials to either one or both sides of the components.

10. The system of claim 1 , wherein the system comprises jigs in which the components are placed and oriented relative to the die for placement of the thermal interface material onto the components, and wherein the die comprises a knife die operable for cutting the portion of the thermal interface material from the supply and a foam filled core usable for tamping the portion of the thermal interface material onto the corresponding one of the components.

11. The system of claim 10 , wherein the system comprises a sensor system to advance the supply of thermal interface material for a next application of another portion of the thermal interface material to a subsequent component of the components after the system has applied the portion of the thermal interface material to the corresponding one of the components.

12. The system of claim 10 , wherein the system is configured with a set distance advance process for the supply of thermal interface material.

13. The system of claim 1 , wherein the system includes active cooling features added to the die for active cooling of the portion of the thermal interface material as the die pushes against and removes the portion of the thermal interface material during application of the portion of the thermal interface material to the corresponding one of the components.

14. The system of claim 1 , wherein the die comprises a foam filled core usable for tamping the portion of the thermal interface material onto the corresponding one of the components, and wherein the system further comprises:
a roll including the supply of thermal interface material;
rollers for causing the supply of thermal interface material to unroll from the roll and travel to a location aligned with the die; and
a salvage for collecting an unused portion of the supply of thermal interface material that remains after the thermal interface material has been applied to the components.

15. The system of claim 1 , wherein:
the die is operable for tamping and cutting the portion of the thermal interface material from the supply that is be

Assignees

• Laird Technologies Inc

Inventors

• Kittel Mark D
• Strader Jason L

Classifications

• H10P72/0442

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/01336

  in solid form, e.g. by using a powder or by laminating a foil · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/073

  of die-attach connectors · CPC title