Thermal interface material assemblies and related methods

Patent metadata

Field	Value
Publication number	US-9330998-B2
Application number	US-201414463196-A
Country	US
Kind code	B2
Filing date	Aug 19, 2014
Priority date	Apr 18, 2014
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

A thermal interface material assembly generally includes a substrate and one or more pillars protruding outwardly away from the substrate. A thermally-conductive heat path is at least partially defined by the substrate and the one or more thermally-conductive pillars, whereby heat may be transferable along the thermally-conductive heat path from a heat source of an electronic device.

First claim

What is claimed is:

1. A thermal interface material assembly comprising:
a substrate;
one or more thermally-conductive pillars protruding outwardly away from the substrate, the one or more thermally-conductive pillars comprise metal or metal alloy; and
a thermally-conductive heat path at least partially defined by and through the substrate and the one or more thermally-conductive pillars, whereby heat may be transferable along the thermally-conductive heat path from a heat source of an electronic device to a heat dissipating device.

2. The thermal interface material assembly of claim 1 , wherein each said thermally-conductive pillar comprises a copper pillar having a first end portion in thermal contact with the substrate and a second end portion opposite the first end portion, and wherein a thermally-conductive solder is in thermal contact with the second end portion of the copper pillar, the thermally-conductive solder having a softening temperature and a thermal conductivity less than the copper pillar.

3. The thermal interface material assembly of claim 2 , wherein the thermally-conductive solder comprises a solder ball.

4. The thermal interface material assembly of claim 2 , wherein the thermally-conductive solder comprises:
a metal alloy having a melting temperature of about 160 degrees Celsius or less; and/or
a low melting temperature phase change metal alloy; and/or
In 51 Bi 32.5 Sn 16.5 ; and/or
a low melting temperature phase change metal alloy having a melting temperature of about 60 degrees Celsius.

5. The thermal interface material assembly of claim 1 , wherein:
the substrate is a single substrate having first and second oppositely facing side portions; and
the one or more thermally-conductive pillars comprise multiple thermally-conductive pillars along each of the first and second oppositely facing side portions of the same single substrate.

6. The thermal interface material assembly of claim 1 , further comprising a coating that covers at least part of the substrate and at least part of the one or more thermally-conductive pillars and that inhibits oxidation.

7. The thermal interface material assembly of claim 6 , wherein:
the coating inhibits oxidation by functioning as a barrier to air; and/or
the coating is a grease, a cured silicone pad, a cured non-silicone pad, a cure-in-place gel, a cure-in-place putty, or a paraffin wax.

8. An electronic device comprising a heat source, a heat dissipating device, and the thermal interface material assembly of claim 1 positioned between the heat source and the heat dissipating device, such that the thermal interface material assembly defines the thermally-conductive heat path from the heat source through the substrate and the one or more thermally-conductive pillars to the heat dissipating device, whereby heat may be transferred along the thermally-conductive heat path from the heat source to the heat dissipating device, and wherein each said thermally-conductive pillar comprises a copper pillar having oxidation resistance protection.

9. A thermal interface material assembly comprising;
a substrate;
one or more thermally-conductive pillars along the substrate; and
a thermally-conductive heat path at least partially defined by the substrate and the one or more thermally-conductive pillars, whereby heat may be transferable along the thermally-conductive neat path from a heat source of an electronic device;
wherein:
each said thermally-conductive pillar comprises a copper pillar having a first end portion in thermal contact with the substrate, a second end portion opposite the first end portion, and a contact resistance reducer in thermal contact with the second end portion of the copper pillar, the contact resistance reducer having a softening temperature and a thermal conductivity less than the copper pillar;
a thermally-conductive coating covers at least part of the substrate, at least part of the copper pillar, and at least part of the contact resistance reducer, the thermally-conductive coating having a softening temperature equal to or less than the softening temperature of the contact resistance reducer, whereby the thermally-conductive coating inhibits oxidation by functioning as a barrier to air and contains migration of the contact resistance reducer.

10. A thermal interface material assembly comprising:
a substrate;
one or more thermally-conductive pillars along the substrate; and
a thermally-conductive heat path at least partially defined by the substrate and the one or more thermally-conductive pillars, whereby heat may be transferable along the thermally-conductive heat path from a heat source of an electronic device;
wherein:
each said thermally-conductive pillar comprises a copper pillar having a first end portion in thermal contact with the substrate, a second end portion opposite the first end portion, and a low melting temperature metal alloy in thermal contact with the second end portion of the copper pillar, the low melting temperature metal alloy having a melting temperature of about 160 degrees Celsius or less; and
a thermally-conductive coating covers at least part of the substrate, at least part of the copper pillar, and at least part of the low temperature melting alloy, the thermally-conductive coating having a thermal conductivity of at least 1 Watt per meter per Kelvin and a softening temperature equal to or less than the melting temperature of the low melting temperature metal alloy.

11. A thermal interface material assembly comprising:
a substrate;
one or more pillars protruding outwardly away from the substrate, each said pillar having a first end portion in thermal contact with the substrate and a second end portion opposite the first end portion;
one or more contact resistance reducers, each said contact resistance reducer in thermal contact with the second end portion of a corresponding one of the one or more pillars, the one or more contact resistance reducers having a softening temperature and a thermal conductivity less than the one or more pillars; and
a thermally-conductive heat path at least partially defined by and through the substrate, the one or more pillars, and the one or more contact resistance reducers, whereby heat may be transferable along the thermally-conductive heat path from a heat source of an electronic device to a heat dissipating device.

12. The thermal interface assembly of claim 11 , wherein:
the one or more pillars comprise copper; and
the one or more contact resistance reducers comprises thermally-conductive solder.

13. The thermal interface material assembly of claim 11 , wherein the one or more contact resistance reducers comprise:
a metal alloy having a melting temperature of about 160 degrees Celsius or less; and/or
In 51 Bi 32.5 Sn 16.5 ; and/or
a low melting temperature phase change metal alloy having a melting temperature of about 60 degrees Celsius.

14. The thermal interface material assembly of claim 11 , wherein:
the substrate is a single substrate having first and second oppositely facing side portions; and
the one or more pillars comprise multiple pillars along each of the first and second oppositely facing side portions of the same single substrate.

15. The thermal interface material assembly of claim 11 , further comprising a coating that covers at least part of the substrate and at least part of the one or more pillars and that inhibits oxidation.

16. The thermal interface material assembly of claim 15 , wherein:
the coating inhibits oxidation of the one or more pillars by functioning as a barrier to air and contains migr

Assignees

• Laird Technologies Inc

Inventors

• Strader Jason L
• Hill Richard F

Classifications

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/251

  Organics · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title