Thermal interface material

Patent metadata

Field	Value
Publication number	US-9316447-B2
Application number	US-201314386191-A
Country	US
Kind code	B2
Filing date	Mar 11, 2013
Priority date	Mar 22, 2012
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

There is provided a thermal interface material, TIM, a thermal interface application comprising such a TIM, and corresponding methods for providing the material and the thermal interface. The TIM comprises a TIM layer in which an activable shrinkage material is distributed, such that upon activation of the shrinkage material the thickness of the TIM layer is increased. In the thermal interface application, where the TIM ( 400 ) is arranged between a heat generating component ( 20 ) and a heat conducting element ( 30 ), the increase in thickness of the TIM layer is utilized to increase the contact pressure on mating surfaces. The TIM is sandwiched between the heat generating component and the heat conducting element before the activation of the shrinkage material, and the distance (h) between the heat generating component and the heat conducting element is restricted such upon activation of the shrinkage material, the restricted maximum height (h) between the heat generating component and the heat conducting element in combination with the TIM increasing the thickness of the TIM layer, the contact pressure on the mating surfaces is increased.

First claim

The invention claimed is:

1. A thermal interface material, TIM comprising:
a TIM layer comprising
an activable shrinkage material that shrinks upon activation of the shrinkage material;
wherein said shrinkage material is distributed in said TIM layer such that upon activation of said shrinkage material the thickness of said TIM layer is increased.

2. The TIM according to claim 1 , wherein said shrinkage material is provided in an oriented direction.

3. The TIM according to claim 2 , wherein said oriented direction is selected within the TIM layer xy-plane.

4. The TIM according to claim 1 , wherein said TIM layer is a multilayer TIM comprising alternate TIM sub layers and shrinkage material layers.

5. The TIM according to claim 1 , wherein said shrinkage material comprises monomers, and wherein said activation of said shrinkage material causes said monomers to polymerize.

6. The TIM according to claim 1 , wherein said shrinkage material is an expanded polymer matrix, and wherein said activation of the shrinkage material causes said expanded polymer matrix to relax back to an un-expanded state.

7. The TIM according to claim 1 , wherein said shrinkage material is heat activated.

8. The thermal interface comprising a TIM according to claim 1 , wherein said TIM before activation of said shrinkage material is sandwiched between a heat generating component and a heat conducting element, wherein the distance between the heat generating component and the heat conducting element is restricted.

9. A method for providing a Thermal Interface Material (TIM) comprising:
providing a TIM layer;
providing in said TIM layer an activable shrinkage material arranged in such a way that upon activation of said shrinkage material the thickness of said TIM layer is increased.

10. The method according to claim 9 , further comprising:
arranging said shrinkage material in an oriented direction.

11. The method according to claim 9 , wherein said shrinkage material is a monomer based material, wherein said activation of said shrinkage material causes monomers of said monomer based material to polymerize.

12. The method according to claim 9 , wherein said shrinkage material is a polymer matrix and wherein said step of orienting said shrinkage material comprises:
mechanically stretching said polymer matrix in a direction corresponding to the TIM layer xy-plane; and subsequently
locking said stretched polymer matrix, thereby providing an expanded polymer matrix.

13. The method according to claim 12 , further comprising providing a multilayer TIM using alternate stacking of at least one TIM sub layer and at least one shrinkage material layer.

14. The method according to claim 9 , further comprising
arranging said TIM between a heat generating component and a heat conducting substrate, wherein the distance between the heat generating component and the heat conducting substrate is restricted.

15. A light emitting device comprising:
a printed circuit board;
a light source, comprising a light emitting diode, arranged on the printed circuit board; and
a heat sink,
wherein the light emitting device further comprises the TIM as claimed in claim 1 , wherein said TIM before activation of said shrinkage material is sandwiched between the printed circuit board and the heat sink and wherein the distance between the printed circuit board and the heat sink is restricted.

16. The method according to claim 9 , wherein the activable shrinkage material shrinks upon activation of the shrinkage materials.

Assignees

• Fleskens Bas
• Den Boer Reinier Imre Anton
• Koninkl Philips Nv

Inventors

• Fleskens Bas
• Den Boer Reinier Imre Anton

Classifications

• H10W40/251

  Organics · CPC title

• H10W40/70 Primary

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• Y10T29/49366

  Sheet joined to sheet · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• F28F21/00

  Constructions of heat-exchange apparatus characterised by the selection of particular materials {(coatings for modifying heat-transfer F28F13/18; coatings for preventing the formation of deposits or corrosion F28F19/02)} · CPC title