Thermoelectric module and manufacturing method thereof
US-10608156-B2 · Mar 31, 2020 · US
Metal paste and thermoelectric module
US10998482B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10998482-B2 |
| Application number | US-202016811359-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 6, 2020 |
| Priority date | Dec 15, 2015 |
| Publication date | May 4, 2021 |
| Grant date | May 4, 2021 |
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- Title
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Abstract
Official abstract text for this publication.
The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.
First claim
Opening claim text (preview).
The invention claimed is: 1. A thermoelectric module comprising a plurality of thermoelectric elements comprising: a thermoelectric semiconductor; an electrode which is composed of a metal material and is connected between the thermoelectric elements; and a bonding layer in which a metal paste is sintered to bond the thermoelectric elements and the electrode, wherein the metal paste comprises: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and wherein the first metal powder has an average particle diameter of 0.1 to 3.0 μm and the second metal powder has an average particle diameter of 0.5 to 10 μm. 2. The thermoelectric module of claim 1 , wherein the bonding layer has porosity of 10% or less. 3. The thermoelectric module of claim 1 , wherein the bonding layer has bonding strength of 1 MPa or more. 4. The thermoelectric module of claim 1 , wherein the bonding layer has resistivity of 70 μΩ·cm or less at 50° C. and 80 μΩ·cm or less at 300° C. 5. The thermoelectric module of claim 1 , wherein the bonding layer has thermal conductivity of 10 W/m·k or more at 27° C. and 15 W/m·k or more at 300° C.
Assignees
Inventors
Classifications
- H01B1/22Primary
the conductive material comprising metals or alloys · CPC title
Ni as the principal constituent · CPC title
Carboxylic acids or salts · CPC title
Bi as the principal constituent · CPC title
Zn as the principal constituent · CPC title
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Frequently asked questions
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- What does patent US10998482B2 cover?
- The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.
- Who is the assignee on this patent?
- Lg Chemical Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01B1/22. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 04 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 10 related publications on this page (citations in our corpus or others sharing the same primary CPC).