Cu Core Ball, Solder Paste, Formed Solder, Cu Core Column, and Solder Joint

Patent metadata

Field	Value
Publication number	US-2016368105-A1
Application number	US-201415034194-A
Country	US
Kind code	A1
Filing date	Nov 4, 2014
Priority date	Nov 5, 2013
Publication date	Dec 22, 2016
Grant date	—

Abstract

Provided are a Cu core ball and a cu core column, which achieve dropping strength and strength against heat cycle. The Cu core ball ( 1 ) contains a Cu ball ( 2 ) made of Cu or a Cu alloy and a solder layer ( 3 ) which is made of a solder alloy composed of Sn and Cu and covers the Cu ball ( 2 ). The solder layer ( 3 ) contains not less than 0.1% through not more than 3.0% of Cu and the remainder is composed of Sn and impurities.

First claim

1 - 12 . (canceled)

13 . A Cu core ball comprising:
a spherical core layer; and a solder layer made of a solder alloy composed of Sn and Cu, the solder layer covering the core layer, wherein in the core layer, purity of Cu is not less than 99.9% through not more than 99.995%; a content of either Pb or Bi, or a total content of Pb and Bi is 1 ppm or more; a content of U is 5 ppb or less; a content of Th is 5 ppb or less; sphericity is 0.95 or more; and an emitting α dose is 0.0200 cph/cm2 or less; and wherein in the solder layer, a content of U is 5 ppb or less; a content of Th is 5 ppb or less; and an α dose emitting from the Cu core ball is 0.0200 cph/cm2 or less.

14 . The Cu core ball of claim 13 , wherein the solder layer comprises not less than 0.1% through not more than 3.0% of Cu, the remainder being composed of Sn and impurities.

15 . The Cu core ball of claim 14 , wherein the core layer covered by a layer made of at least one element selected from Ni and Co is covered by the solder layer.

16 . A solder paste comprising the Cu core ball of claim 13 .

17 . A formed solder comprising the Cu core ball of claim 13 .

18 . A solder joint comprising the Cu core ball of claim 13 .

Assignees

• Senju Metal Industry Co

Inventors

• Hattori Takahiro
• Soma Daisuke
• Roppongi Takahiro
• Sato Isamu

Classifications

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/29

  Bond pads specially adapted therefor · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/07234

  Using a reflow oven · CPC title

• H10W72/016

  of strap connectors · CPC title