Computer system with modified module socket

Patent metadata

Field	Value
Publication number	US-10993324-B2
Application number	US-201916451367-A
Country	US
Kind code	B2
Filing date	Jun 25, 2019
Priority date	Jun 25, 2019
Publication date	Apr 27, 2021
Grant date	Apr 27, 2021

Abstract

A modified socket mechanism comprises a printed circuit board and a connector component located on a first face of the printed circuit board. The modified socket mechanism may comprise a first region of electrical contacts located on the first face. The first region of electrical contacts may be designed to interface with a processor module. The modified socket mechanism may also comprise a second region of electrical contacts located on a second face of the printed circuit board. The second region of electrical contacts may be designed to interface with a motherboard. The modified socket mechanism may also comprise a first electrical connection between the connector component and the first region of electrical contacts through the printed circuit board. Finally, the modified socket mechanism may also comprise a second electrical connection between the first region of electrical contacts and the second region of electrical contacts through the printed circuit board.

First claim

What is claimed is:

1. A system comprising:
a module socket mechanism mounted on a motherboard printed circuit board;
a processor assembly module mounted on the module socket mechanism, the processor assembly module comprising:
a processor die mounted on a module printed circuit board;
the module printed circuit board mounted to the module socket mechanism, wherein the module printed circuit board transmits electrical signals between the processor die and the motherboard printed circuit board through the module socket mechanism;

a connector component mounted to a surface of the module socket mechanism;
a spacer located near the connector component and between the module socket mechanism and the motherboard printed circuit board; and
an electrical connection between the connector component and the processor assembly, the electrical connection traveling through the module socket mechanism and bypassing the motherboard printed circuit board.

2. The System of claim 1 , wherein the spacer is a two-portion structure support spacer.

3. The system of claim 1 , further comprising a first stiffener located on the socket mechanism between the connector component and an edge of the socket mechanism; and a second stiffener located between the socket mechanism and the motherboard printed circuit board.

4. The system of claim 1 , further comprising:
a retention bracket mounted to the module socket mechanism; and
moveable retention hardware that is moveable between an open and closed position;
wherein the retention bracket is designed to interface with moveable retention hardware when the moveable retention hardware is in the closed position.

5. The system of claim 4 , wherein the moveable retention hardware is structurally secured to a stable portion of the system.

6. The system of claim 4 , wherein the moveable retention hardware interfaces with the connector component when in the closed position.

7. A method of assembling a computer system, the method comprising:
attaching a connector component to a first face of a module socket mechanism, wherein the first face of the module socket mechanism is configured to interface with a processor assembly module;
attaching a second face of the module socket mechanism to a motherboard printed circuit board;
attaching a structural support between the second face of the module socket mechanism and the motherboard printed circuit board, wherein the structural support does not supply an electrical connection and wherein is located near an axis that is perpendicular to the surface of the motherboard printed circuit board and passes through the connector component; and
creating an electrical connection between a module printed circuit board of the module socket mechanism and the connector component.

8. The method of claim 7 , further comprising attaching a stiffener to the socket mechanism.

9. The method of claim 8 , wherein the stiffener is located at the edge of the second face of the module socket mechanism between the connector component and the edge of the module socket mechanism.

10. The method of claim 7 , further comprising adding a second stiffener to the socket mechanism between the motherboard printed circuit board and the second face of the module socket mechanism.

11. The method of claim 7 , wherein the structural support takes the form of a ball grid array.

12. The method of claim 7 , wherein the structural support takes the form of a two-portion structural support spacer.

13. The method of 7 , wherein attaching the structural support comprises mounting the structural support between the module socket mechanism and the motherboard printed circuit board, such that an axis that is perpendicular to the first face of the module socket mechanism and that passes through the center of the connector component also passes through the of the structural support.

14. A modified socket mechanism, comprising:
a printed circuit board;
a connector component located on a first face of the printed circuit board;
a first region of electrical contacts located on the first face, wherein the first region of electrical contacts are designed to interface with a processor module;
a second region of electrical contacts located on a second face of the printed circuit board, wherein the second region of electrical contacts are designed to interface with a motherboard;
a first electrical connection between the connector component and the first region of electrical contacts through the printed circuit board;
a second electrical connection between the first region of electrical contacts and the second region of electrical contacts through the printed circuit board;
a retention brace located on the first face of the modified socket mechanism between the connector component and an edge of the printed circuit board, wherein the retention brace is configured to interface with a retention clamp.

15. The modified socket mechanism of claim 14 , further comprising:
a first stiffener located on the first face of the printed circuit board; and
a second stiffener located on the second face of the printed circuit board.

16. The modified socket mechanism of claim 15 , wherein the first stiffener and second stiffener span the length of the modified socket mechanism.

17. The modified socket mechanism of claim 14 , further comprising a spacer located on the second face of the printed circuit board such that an axis that is perpendicular to the first face of the module socket mechanism and that passes through the center of the connector component also passes through the center of the spacer.

18. The modified socket mechanism of claim 17 , wherein the spacer is a 2-portion structural support.

Assignees

• IBM

Inventors

• Arvin Charles Leon
• Hoffmeyer Mark K
• Drummond Kevin
• Muzzy Chris

Classifications

• H05K1/181

  associated with surface mounted components · CPC title

• H01R13/11

  Resilient sockets (carrying separate resilient parts H01R13/15) · CPC title

• H05K1/141 Primary

  One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence) · CPC title

• H05K1/144

  Stacked arrangements of planar printed circuit boards · CPC title

• H05K2201/049

  PCB for one component, e.g. for mounting onto mother PCB · CPC title