Chip package connector assembly

Patent metadata

Field	Value
Publication number	US-9674954-B2
Application number	US-201313826614-A
Country	US
Kind code	B2
Filing date	Mar 14, 2013
Priority date	Mar 14, 2013
Publication date	Jun 6, 2017
Grant date	Jun 6, 2017

Abstract

This disclosure relates generally to a chip package assembly arranged to be electrically coupled to a circuit board including a plurality of circuit board contacts. The chip package assembly may include a chip package including a first side and a second side, the second side including a first plurality of contacts arranged to be electrically coupled to the plurality of circuit board contacts and a second plurality of contacts arranged to be electrically coupled to a remote device via a connector assembly.

First claim

What is claimed is:

1. A chip package assembly arranged to be electrically coupled to a circuit board including a plurality of circuit board contacts, comprising:
a chip package including a first side and a second side, the second side including:
a first plurality of contacts arranged to be electrically coupled to the plurality of circuit board contacts; and
a second plurality of contacts arranged to be electrically coupled to a remote device via a connector assembly; and

a chip package connector comprising a plurality of conductive members electrically coupled to the second plurality of contacts and the remote device; wherein the first plurality of contacts are arranged to be electrically and mechanically coupled to at least one of a circuit board and a socket, the circuit board including the circuit board contacts and the socket being arranged to mechanically seat the chip package.

2. The chip package assembly of claim 1 , wherein the connector assembly further comprises:
an interposer, including:
a first plurality of interposer contacts;

a second plurality of interposer contacts; and
a plurality of traces, each of the traces electrically coupling one of the first plurality of interposer contacts to one of the second plurality of interposer contacts; and
an interposer connector positioned with respect to the interposer and arranged to mechanically engage with the chip package connector; wherein the first plurality of contacts and the second plurality of contacts of the chip package have a first distance between adjacent contacts and the second plurality of interposer contacts have a second distance between adjacent contacts greater than the first distance between adjacent contacts.

3. The chip package assembly of claim 1 , wherein the chip package is seated in the socket and the socket provides electrical coupling between the first plurality of contacts and the circuit board contacts.

4. The chip package assembly of claim 1 , wherein the chip package is electrically and mechanically coupled to the circuit board via solder balls between the first plurality of contacts and the circuit board contacts.

5. The chip package assembly of claim 2 , wherein the connector assembly is coupled to the remote device via a conductive cable.

6. A connector assembly comprising:
an interposer, including:
a first plurality of interposer contacts;

a second plurality of interposer contacts; and
a plurality of traces, each of the traces electrically coupling one of the first plurality of interposer contacts to one of the second plurality of interposer contacts; and
a first connector positioned with respect to the interposer;
wherein the first plurality of interposer contacts have a first distance between adjacent contacts and the second plurality of interposer contacts have a second distance between adjacent contacts greater than the first distance between adjacent contacts;
wherein the first connector is arranged to be electrically and mechanically coupled to a second connector;
wherein the interposer comprises a circuit board, wherein the first and second plurality of interposer contacts are positioned on the circuit board and the traces are at least one of embedded in the circuit board and positioned on the circuit board; and
wherein the circuit board has a first side and a second side opposite the first side, wherein all of the first plurality of interposer contacts are located on the first side, wherein a first subset of the second plurality of interposer contacts are positioned on the first side, and wherein a second subset of the second plurality of interposer contacts are positioned on the second side.

7. The connector assembly of claim 6 , wherein the first plurality of interposer contacts form a plurality of rows on the first side and wherein the second plurality of interposer contacts form only one row on each of the first side and the second side.

8. The connector assembly of claim 6 , wherein the first plurality of interposer contacts are proximate a first end of the interposer and wherein the second plurality of interposer contacts are proximate a second end of the interposer opposite the first end.

9. The connector assembly of claim 6 , wherein the second plurality of interposer contacts are arranged to be coupled to individual members of a cable.

10. The connector assembly of claim 9 , wherein the second connector includes conductive members arranged to be electrically coupled to contacts on a chip package, and wherein the first and second plurality of interposer contacts and the traces are arranged to electrically couple the contacts to the individual members of the cable.

11. An assembly, comprising:
a chip package assembly, comprising:
a chip package having a first side and a second side opposite the first side, the chip package include a plurality of electrical contacts positioned with respect to the first side;
a package connector positioned with respect to the first side; and
componentry positioned to form a gap between the componentry and the first side, the package connector being positioned, at least in part, within the gap; and

a connector assembly, comprising:
an interposer, including:
a first plurality of interposer contacts;
a second plurality of interposer contacts; and
a plurality of traces, each of the traces electrically coupling one of the first plurality of interposer contacts to one of the second plurality of interposer contacts; and

an interposer connector positioned with respect to the interposer;
wherein the first plurality of interposer contacts have a first distance between adjacent contacts and the second plurality of interposer contacts have a second distance between adjacent contacts greater than the first distance between adjacent contacts;
wherein the interposer connector is arranged to be electrically and mechanically coupled to the package connector at least partially within the gap.

12. The assembly of claim 11 , wherein the plurality of electrical contacts include a plurality of circuit board contacts on the first side, and wherein the componentry is at least one of:
a socket arranged to seat the chip package and electrically couple to the contacts; and
a circuit board.

13. The assembly of claim 11 , wherein the second side includes a plurality of circuit board contacts, and wherein the componentry is heat management componentry.

14. The assembly of claim 12 , wherein the componentry comprises both the socket and the circuit board, wherein the socket is electrically and mechanically coupled to the circuit board.

15. The assembly of claim 13 , wherein the heat management componentry comprises at least one of a heat spreader and a heat sink.

16. The assembly of claim 14 , wherein the gap is between the first side of the chip package and the circuit board.

17. The assembly of claim 15 , wherein the heat management componentry comprises both the heat spread and the heat sink and wherein the gap is between the first side of the chip package and the heat sink.

Assignees

• Intel Corp

Inventors

• Swaminathan Rajasekaran
• Tran Donald T
• Stone Brent S
• Viswanath Ram

Classifications

• H01R12/62

  connecting to rigid printed circuits or like structures · CPC title

• H05K2201/10189

  Non-printed connector · CPC title

• Y02P70/611

  Cross-Sectional Technologies · mapped topic

• H05K2201/094

  Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title