Oxygen barrier compositions and related methods

Patent metadata

Field	Value
Publication number	US-9695334-B2
Application number	US-201514855007-A
Country	US
Kind code	B2
Filing date	Sep 15, 2015
Priority date	Jul 17, 2009
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

Oxygen barrier compositions for electrical devices and their related methods are provided. In certain embodiments, the oxygen barrier compositions comprise a meta-substituted aromatic resin and an additional aromatic epoxy resin. In some embodiments, the compositions have a chlorine content of less than approximately 1000 ppm. The compositions may have an oxygen permeability of less than approximately 0.4 cm 3 ·mm/m 2 ·atm·day at approximately 0% relative humidity and approximately 23° C. In certain embodiments, methods of curing the oxygen barrier compositions comprise partially curing the composition where, the partial cure is achieved through ultraviolet radiation or heat.

First claim

What is claimed is:

1. A polymeric positive temperature coefficient device sealed with an oxygen barrier composition comprising:
a meta-substituted aromatic resin selected from the group consisting of: meta-substituted resorcinol epoxy resins, meta-substituted acrylic resorcinol resins, meta-substituted methacrylic-resorcinol resins, meta-substituted tetraglycidyl xylenediamine resins, resorcinol, and combinations thereof; and
an additional aromatic epoxy resin selected from the group consisting of: bisphenol-F diglycidyl ether, bisphenol-A diglycidyl ether, epoxidized phenol novolac resins, epoxidized cresol novolac resins, polycyclic epoxy resins, naphthalene diepoxides, and combinations thereof;
wherein the composition is capable of undergoing a B-stageable cure or a photoinitiated cure, and
wherein the composition has an oxygen permeability of less than approximately 0.4 cm3·mm/m2·atm·day at approximately 0% relative humidity and approximately 23° C.

2. A method of coating an electrical device comprising:
providing a oxygen barrier composition having: (i) a meta-substituted aromatic resin selected from the group consisting of: meta-substituted resorcinol epoxy resins, meta-substituted acrylic resorcinol resins, meta-substituted methacrylic-resorcinol resins, meta-substituted tetraglycidyl xylenediamine resins, resorcinol, oligomers, adducts, and combinations thereof, (ii) an additional aromatic epoxy resin selected from the group consisting of: bisphenol-F diglycidyl ether, bisphenol-A diglycidyl ether, epoxidized phenol novolac resins, epoxidized cresol novolac resins, polycyclic epoxy resins, naphthalene diepoxides, and combinations thereof, and (iii) an amine curing agent selected from the group consisting of: aromatic amine curing agents, dicyandiamide, boron trifluoride amine complexes, and combinations thereof;
heating the composition to commence curing the composition;
cooling the composition prior to completion of the curing, wherein a partially cured coating is formed;
providing an electrical device having first and second components;
applying the partially cured coating to the first component of the electrical device; and
soldering the first component of the electrical device to the second component of the electrical device, wherein the partially cured coating is fully cured during the soldering;
wherein the meta-substituted aromatic resin is resorcinol diglycidyl ether or an oligomer or an adduct thereof.

3. The method of claim 2 , wherein the composition further comprises an accelerant capable of reducing time or temperature of the heating in relation to a similar oxygen barrier composition without the accelerant, wherein the accelerant is selected from the group consisting of: phenyl ureas, imidazoles, boron trichloride amine complexes, aliphatic bis ureas, meta-substituted phenols, resorcinol, phloroglucinol, and combinations thereof.

Assignees

• Littelfuse Inc
• Littlefuse Inc

Inventors

• Golden Josh H
• Galla Matthew P
• Navarro Luis A

Classifications

• H10W74/473

  containing a filler · CPC title

• C09D163/00 Primary

  Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins · CPC title

• H01L2924/00

  Electricity · mapped topic

• C08G59/38

  together with di-epoxy compounds · CPC title

• H01L23/295

  Electricity · mapped topic