Modified epoxy resin composition

US9598528B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9598528-B2
Application numberUS-57593905-A
CountryUS
Kind codeB2
Filing dateSep 21, 2005
Priority dateSep 29, 2004
Publication dateMar 21, 2017
Grant dateMar 21, 2017

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  5. First independent claim

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Abstract

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A crystalline epoxy resin is modified to provide an epoxy resin composition capable of producing a cured product with excellent cured product properties. The modified epoxy resin composition comprises compound A having in its molecule a functional group represented by formula (1): (where each of R 1 and R 2 is an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group, or a halogenated, aminated or nitrated derivative thereof), and compound B having a glycidyl group in its molecule. The compound A is preferably a compound resulting from replacement of from at least one to at most n glycidyl groups among n glycidyl groups in a molecule (where n is an integer of from 2 to 16) with the functional group of the formula (1). The compound B is preferably a compound having n glycidyl groups (where n is an integer of from 2 to 16) in its molecule.

First claim

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The invention claimed is: 1. A modified epoxy resin composition, comprising: a component (A) which is a mixture of compounds resulting from replacement of one glycidyl group, two glycidyl groups, and three glycidyl groups of α-type tris-(2,3-epoxypropyl)-isocyanurate with a melting point of from 98 to 107° C. with a functional group represented by formula (1) and prepared by adding acid anhydrides of formula (2): wherein each of R 1 and R 2 is an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group, or a halogenated, aminated or nitrated derivative thereof; and a compound (B) which is an α-type tris-(2,3-epoxypropyl-isocyanurate with a melting point of from 98 to 107° C.; wherein a molar ratio of the component (A) to the compound (B) is from 3.33/1 to 2/3 the modified epoxy resin composition is a liquid which is stable for at least 50 days at room temperature, a total number of glycidyl groups per molecule in component (A) and compound (B) is at least two on average of a total number of (A) and (B) molecules. 2. A process for producing the modified epoxy resin composition as defined in claim 1 , comprising: reacting compound (B) with an acid anhydride; wherein a molar ratio of glycidyl group in the compound (B) to the acid anhydride is from 10/1 to 2/1. 3. The modified epoxy resin composition according to claim 1 , wherein compound (B) has n glycidyl groups in its molecule and n is 3. 4. A modified epoxy resin composition, comprising: a compound (A) which is a compound resulting from replacement of an α-type glycidyl group of tris-(2,3-epoxypropyl)-isocyanurate with a melting point of from 98 to 107° C. with a functional group represented by formula (1): wherein each of R 1 and R 2 is an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group, or a halogenated, aminated or nitrated derivative thereof wherein at least one of R 1 and R 2 is an alkynyl group or a halogenated, aminated or nitrated derivative of a group selected from the group consisting of an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, and a heterocyclic group; and a compound (B) wherein the compound (B) is an α-type tris-(2,3-epoxypropyl)-isocyanurate with a melting point of from 98 to 107° C.; wherein the modified epoxy resin composition is a liquid which is stable for at least 50 days at room temperature, a total number of glycidyl groups per molecule in compounds (A) and (B) is at least two on average of a total number of (A) and (B) molecules. 5. The modified epoxy resin composition according to claim 4 , wherein at least one of R 1 and R 2 is an alkynyl group. 6. The modified epoxy resin composition according to claim 4 , wherein at least one of R 1 and R 2 is a halogenated, aminated or nitrated derivative of an alkyl group. 7. The modified epoxy resin composition according to claim 4 , wherein at least one of R 1 and R 2 is a halogenated, aminated or nitrated derivative of an alkenyl group. 8. The modified epoxy resin composition according to claim 4 , wherein at least one of R 1 and R 2 is a halogenated, aminated or nitrated derivative of an alkynyl group. 9. The modified epoxy resin composition according to claim 4 , wherein at least one of R 1 and R 2 is a halogenated, aminated or nitrated derivative of an aryl group. 10. The modified epoxy resin composition according to claim 4 , wherein at least one of R 1 and R 2 is a halogenated, aminated or nitrated derivative of an aralkyl group. 11. The modified epoxy resin composition according to claim 4 , wherein at least one of R 1 and R 2 is a halogenated, aminated or nitrated derivative of a heterocyclic group.

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What does patent US9598528B2 cover?
A crystalline epoxy resin is modified to provide an epoxy resin composition capable of producing a cured product with excellent cured product properties. The modified epoxy resin composition comprises compound A having in its molecule a functional group represented by formula (1): (where each of R 1 and R 2 is an alkyl group, an alkenyl group, an alkynyl group…
Who is the assignee on this patent?
Gunji Yasuhiro, Takeyama Toshiaki, Nissan Chemical Ind Ltd
What technology area does this patent fall under?
Primary CPC classification C08G18/5027. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 21 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).