Aerosol provision device
US-2024415174-A1 · Dec 19, 2024 · US
Binary compounds of nitrogen with boron
Binary compounds of nitrogen with boron · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08K2003/385 |
| Official title | {Binary compounds of nitrogen with boron} |
| Display label | Binary compounds of nitrogen with boron |
| Total patents | 969 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 24 |
| 2016 | 53 |
| 2017 | 62 |
| 2018 | 70 |
| 2019 | 74 |
| 2020 | 119 |
| 2021 | 106 |
| 2022 | 119 |
| 2023 | 130 |
| 2024 | 93 |
| 2025 | 105 |
| 2026 | 14 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Lightweight and corrosion resistant abradable coating
US-9528008-B2 · Dec 27, 2016 · US
Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
US-9516741-B2 · Dec 6, 2016 · US
Inorganic filler, resin composition comprising the same and heat radiation substrate using the same
US-9505914-B2 · Nov 29, 2016 · US
Agglomerated boron nitride particles, production method for agglomerated boron nitride particles, resin composition including agglomerated boron nitride particles, moulded body, and sheet
US-2016340191-A1 · Nov 24, 2016 · US
Thermally conductive pre-applied underfill formulations and uses thereof
US-2016340557-A1 · Nov 24, 2016 · US
Novel Thermal Protection System for Powered Circuit Boards Including Fuses
US-2016333194-A1 · Nov 17, 2016 · US
High aspect boron nitride, methods, and composition containing the same
US-2016325994-A1 · Nov 10, 2016 · US
Coating of a metal sheet or strip
US-2016319149-A9 · Nov 3, 2016 · US
Oil and gas recovery articles
US-2016312000-A1 · Oct 27, 2016 · US
Highly-thermally-conductive resin composition, and resin material for heat dissipation/heat transfer and thermally conductive film comprising same
US-2016304762-A1 · Oct 20, 2016 · US
Epoxy resin composition, and printed circuit board using same
US-9468096-B2 · Oct 11, 2016 · US
Component parts produced by thermoplastic processing of polymer/boron nitride compounds, polymer/boron nitride compounds for producing such component parts, method for producing such component parts and use thereof
US-2016263791-A1 · Sep 15, 2016 · US
Epoxy resin composition and printed circuit board using same
US-9445500-B2 · Sep 13, 2016 · US
Epoxy resin composition and printed circuit board
US-9445498-B2 · Sep 13, 2016 · US
Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
US-2016227644-A1 · Aug 4, 2016 · US
Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same
US-2016222256-A1 · Aug 4, 2016 · US
Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same
US-2016215172-A1 · Jul 28, 2016 · US
Boron nitride agglomerates, method for the production thereof and use thereof
US-9371449-B2 · Jun 21, 2016 · US
Tire with boron nitride reinforced polyurethane
US-2016152793-A1 · Jun 2, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08K2003/385?
- CPC C08K2003/385 is the Cooperative Patent Classification code for “Binary compounds of nitrogen with boron.”
- How many patents are filed under CPC C08K2003/385 (Binary compounds of nitrogen with boron)?
- Our database includes 969 publications tagged with this CPC code.
- Is patent activity under CPC C08K2003/385 growing?
- Publication counts under this code: 93 in 2024 vs 105 in 2025 (latest complete years).