Printed circuit board (pcb) with wrapped conductor
US-2015382460-A1 · Dec 31, 2015 · US
Front referenced anode
US9028657B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9028657-B2 |
| Application number | US-87948410-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 10, 2010 |
| Priority date | Sep 10, 2010 |
| Publication date | May 12, 2015 |
| Grant date | May 12, 2015 |
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Abstract
Official abstract text for this publication.
Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.
First claim
Opening claim text (preview).
We claim: 1. An electroplating apparatus, comprising: (a) a work piece holder configured to hold a semiconductor wafer in place during electroplating; (b) an anode support comprising an anode positioning mechanism configured for continuously adjusting the position of a consumable anode to provide a consistent distance between the consumable anode and the semiconductor wafer over a period of time during which the consumable anode is consumed; (c) the consumable anode, wherein t…
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Electricity · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
- C25D7/123Primary
Chemistry & Metallurgy · mapped topic
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Frequently asked questions
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- What does patent US9028657B2 cover?
- Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.
- Who is the assignee on this patent?
- Feng Jingbin, Stowell R Marshall, Ghongadi Shantinath, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification C25D7/123. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue May 12 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).