Wafer bonding apparatus and wafer bonding system using the same

Patent metadata

Field	Value
Publication number	US-10971379-B2
Application number	US-201916276904-A
Country	US
Kind code	B2
Filing date	Feb 15, 2019
Priority date	Jul 6, 2018
Publication date	Apr 6, 2021
Grant date	Apr 6, 2021

Abstract

A wafer bonding apparatus includes a first bonding chuck to fix a first wafer on a first surface thereof, a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface, a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface, and a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion.

First claim

What is claimed is:

1. A wafer bonding apparatus, comprising:
a first bonding chuck to fix a first wafer arranged on a first surface thereof;
a second bonding chuck to fix a second wafer on a second surface thereof, the second surface facing the first surface;
a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface; and
a membrane member having a protrusion protruding from a center portion of the second surface towards the first surface and a planar portion defining the protrusion in an outer region surrounding the center portion of the second surface.

2. The wafer bonding apparatus as claimed in claim 1 , wherein a thickness of the protrusion of the membrane member is less than a thickness of the planar portion, and the membrane member includes a flexible material.

3. The wafer bonding apparatus as claimed in claim 2 , further comprising an air pump to provide a pneumatic pressure to a lower surface of the membrane member that faces an upper surface where the membrane member contacts the second wafer, wherein the protrusion of the membrane member is formed by the pneumatic pressure as a hemispherical surface having a predetermined radius in a protruding direction.

4. The wafer bonding apparatus as claimed in claim 3 , wherein the predetermined radius of the hemispherical surface varies depending on a variation in the pneumatic pressure.

5. The wafer bonding apparatus as claimed in claim 1 , wherein a thickness of the protrusion of the membrane member is greater than a thickness of the planar portion, and the membrane member includes a rigid material.

6. The wafer bonding apparatus as claimed in claim 5 , wherein the protrusion of the membrane member is provided as a truncated cone of a stair type.

7. The wafer bonding apparatus as claimed in claim 1 , wherein the membrane member is replaceable with a membrane member of a different shape.

8. The wafer bonding apparatus as claimed in claim 1 , wherein the bonding initiation member pushes a center of the first wafer in a direction towards the second wafer to obtain a bonding propagation distance in the first wafer, and the membrane member forces the second wafer to protrude from a center portion thereof towards the first wafer and to have a flat outer region.

9. The wafer bonding apparatus as claimed in claim 8 , further comprising a sensor spaced apart from the first bonding chuck and the second bonding chuck to measure the bonding propagation distance.

10. The wafer bonding apparatus as claimed in claim 9 , wherein the sensor includes a plurality of sensors, and at least three sensors are arranged to be spaced apart from each other with an azimuth of 45° from a location corresponding to an alignment feature in the first wafer.

11. A wafer bonding apparatus, comprising:
a first bonding chuck to fix a first wafer arranged on a first surface thereof;
a second bonding chuck to fix a second wafer on a second surface thereof, the second surface facing the first surface;
a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface;
an aperture stop serving as the second surface of the second bonding chuck; and
a membrane member having a protrusion protruding from a center portion of the second surface towards the first surface and a planar portion in a closed portion of the aperture stop, wherein the protrusion protrudes from an opening portion of the aperture stop in a direction towards the first surface.

12. The wafer bonding apparatus as claimed in claim 11 , wherein a thickness of the membrane member is substantially constant throughout a whole surface thereof, and the membrane member includes a flexible material.

13. The wafer bonding apparatus as claimed in claim 12 , further comprising an air pump to provide a pneumatic pressure to a lower surface of the membrane member that faces an upper surface where the membrane member contacts the second wafer, and the protrusion of the membrane member is formed by the pneumatic pressure as a hemispherical surface having a predetermined radius in a protruding direction.

14. The wafer bonding apparatus as claimed in claim 13 , wherein the predetermined radius of the hemispherical surface varies according to a variation in the pneumatic pressure and/or an aperture ratio of the aperture stop.

15. The wafer bonding apparatus as claimed in claim 11 , wherein:
the bonding initiation member pushes a center of the first wafer in a direction towards the second wafer to obtain a bonding propagation distance in the first wafer, and
the membrane member and the aperture stop force the second wafer to have a center portion protruding towards the first wafer and to have a flat outer region.

16. A wafer bonding system, comprising:
a first bonding chuck to fix a first wafer arranged on a first surface thereof;
a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface;
a bonding initiation member at a center of the first bonding chuck to push the first wafer in a direction towards the second surface;
a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion of the second surface;
a sensor spaced apart from the first bonding chuck and the second bonding chuck to measure a bonding propagation distance of the first wafer; and
a controller to control a shape of the membrane member according to the bonding propagation distance.

17. The wafer bonding system as claimed in claim 16 , further comprising an air pump to provide a pneumatic pressure to a lower surface of the membrane member that faces an upper surface where the membrane member contacts the second wafer, via the second bonding chuck, and the protrusion of the membrane member is formed by the pneumatic pressure as a hemispherical surface having a predetermined radius in a protruding direction.

18. The wafer bonding system as claimed in claim 16 , wherein the second surface of the second bonding chuck includes an aperture stop, and the membrane member includes the protrusion protruding from an opening portion of the aperture stop in a direction towards the first surface and the planar portion in a closed portion of the aperture stop.

19. The wafer bonding system as claimed in claim 16 , further comprising a data processor to receive first data about the bonding propagation distance measured by the sensor according to a kind of the first wafer.

20. The wafer bonding system as claimed in claim 19 , wherein the data processor generates second data for feeding back about adjustment of the shape of the membrane member, based on the first data.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Jun-Hyung
• Kim Sung-Hyup
• Kim Tae-Yeong

Classifications

• H10P90/1914

  using bonding · CPC title

• H10P72/76

  using mechanical means, e.g. clamps or pinches · CPC title

• H10P10/128

  by direct semiconductor to semiconductor bonding · CPC title

• H10W72/071

  Connecting or disconnecting · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title