Film forming system, film forming method, and computer storage medium

Patent metadata

Field	Value
Publication number	US-10964606-B2
Application number	US-201816481136-A
Country	US
Kind code	B2
Filing date	Jan 4, 2018
Priority date	Feb 7, 2017
Publication date	Mar 30, 2021
Grant date	Mar 30, 2021

Abstract

A film forming system is to form an organic film on a substrate having a pattern formed on a surface thereof, includes: an organic film formation section configured to perform an organic film formation treatment on the substrate to form the organic film on the substrate; a film thickness measurement section configured to measure a film thickness of the organic film on the substrate; and an ultraviolet treatment section configured to perform an ultraviolet irradiation treatment on the organic film on the substrate to remove a surface of the organic film. In the film forming system, the organic film formation section, the film thickness measurement section, and the ultraviolet treatment section are disposed side by side in this order along a transfer direction of the substrate.

First claim

What is claimed is:

1. A film forming system for forming an organic film on a substrate having a pattern formed on a surface thereof, the film forming system comprising:
an organic film formation section configured to perform an organic film formation treatment on the substrate to form the organic film on the substrate;
a film thickness measurement section configured to measure a film thickness of the organic film on the substrate;
an ultraviolet treatment section configured to perform an ultraviolet irradiation treatment on the organic film on the substrate to remove a surface of the organic film; and
a controller configured to control the organic film formation section, the film thickness measurement section, and the ultraviolet treatment section,
wherein the controller is configured to perform control so that the film thickness measurement section measures a film thickness of the organic film which has been formed by the organic film formation treatment by the organic film formation section and from which the surface has been removed by the ultraviolet treatment section, and adjust a treatment condition in the organic film formation treatment based on a measurement result,

wherein the film thickness measurement section includes a first measurement part configured to measure the film thickness using a Scatterometry method, and a second measurement part configured to measure the film thickness based on a captured image.

2. A film forming method of forming an organic film on a substrate having a pattern formed on a surface thereof, the film forming method comprising:
performing an organic film formation treatment on the substrate to form the organic film on the substrate;
removing a surface of the organic film formed by the organic film formation treatment, by an ultraviolet irradiation treatment;
measuring a film thickness of the organic film on the substrate,
wherein a treatment condition in the organic film formation treatment or in the ultraviolet irradiation treatment is adjusted based on a measurement result at the measuring the film thickness of the organic film,
wherein the measuring the film thickness of the organic film includes measuring a film thickness of the organic film from which the surface has been removed by the ultraviolet irradiation treatment, and
wherein the treatment condition in the organic film formation treatment is adjusted based on a measurement result at the measuring the film thickness of the organic film from which the surface has been removed by the ultraviolet irradiation treatment.

3. The film forming method according to claim 2 , further comprising performing an additional organic film formation treatment on the organic film from which the surface has been removed,
wherein the measuring the film thickness of the organic film includes measuring a film thickness of the organic film after the additional organic film formation treatment, and
wherein a treatment condition in the additional organic film formation treatment is adjusted based on a measurement result at the measuring the film thickness of the organic film after the additional organic film formation treatment.

Assignees

• Tokyo Electron Ltd

Inventors

• Shimura Satoru
• Enomoto Masashi

Classifications

• H10P76/2041

  Photolithographic processes · CPC title

• H10P14/683

  carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC · CPC title

• H10P74/23 Primary

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10W20/01

  Manufacture or treatment · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title