Film formation device and film formation method for forming metal film

Patent metadata

Field	Value
Publication number	US-10047452-B2
Application number	US-201314371036-A
Country	US
Kind code	B2
Filing date	Feb 21, 2013
Priority date	Feb 23, 2012
Publication date	Aug 14, 2018
Grant date	Aug 14, 2018

Abstract

Provided are a film formation device and a film formation method for forming a metal film, with which metal films with a desired thickness can be continuously formed on surfaces of a plurality of substrates. A film formation device 1A includes at least a positive electrode 11, a negative electrode 12, a solid electrolyte membrane 13 arranged on a surface of the positive electrode 12, between. the positive electrode and a substrate to serve as the negative electrode, and a power supply unit E adapted to apply a voltage across the positive electrode 11 and the substrate B. A voltage is applied across the positive electrode 11 and the substrate B to deposit metal on a surface of the substrate from metal ions contained in the solid electrolyte membrane 13, whereby a metal film F made of metal is formed, The positive electrode 11 is made of a porous body that allows a solution L containing metal ions to pass therethrough and supplies the metal ions to the solid electrolyte membrane 13.

First claim

The invention claimed is:

1. A film formation device for forming a metal film, comprising at least:
a positive electrode;
a solid electrolyte membrane formed on a surface of the positive electrode, the solid electrolyte membrane being disposed between the positive electrode and a substrate to serve as a negative electrode; and
a power supply unit adapted to apply a voltage across the positive electrode and the substrate, wherein
a voltage is applied across the positive electrode and the substrate to deposit metal on a surface of the substrate from metal ions contained in the solid electrolyte membrane, so that a metal film made of the metal is formed,
the positive electrode is made of a porous body that allows a solution containing the metal ions to pass therethrough and supplies the metal ions to the solid electrolyte membrane,
the film formation device further comprises a pressure unit adapted to move the positive electrode toward the substrate, thereby pressing the solid electrolyte membrane against the substrate on which a film is to be formed,
the film formation device further comprises a conducting portion that is formed in a manner surrounding a film formation region of the substrate during formation of the film, the conducting portion being adapted to electrically connect a negative electrode of the power supply unit and the substrate,
the solid electrolyte membrane has a shape that conforms to a shape of the film formation region of the substrate,
an insulator is further disposed on the positive electrode in a manner surrounding the solid electrolyte membrane, and
the conducting portion includes a plurality of conducting protrusions that are disposed on the insulator in a manner protruding toward the substrate from a surface of the insulator.

2. The film formation device for forming a metal film according to claim 1 , wherein the conducting protrusions have a structure in which, when the conducting protrusions are made into contact with the substrate upon application of pressure by the pressure unit, the conducting protrusions are pressed into the insulator due to the pressure applied.

3. A film formation device for forming a metal film, comprising at least:
a positive electrode;
a solid electrolyte membrane formed on a surface of the positive electrode, the solid electrolyte membrane being disposed between the positive electrode and a substrate to serve as a negative electrode; and
a power supply unit adapted to apply a voltage across the positive electrode and the substrate, wherein
a voltage is applied across the positive electrode and the substrate to deposit metal on a surface of the substrate from metal ions contained in the solid electrolyte membrane, so that a metal film made of the metal is formed,
the positive electrode is made of a porous body that allows a solution containing the metal ions to pass therethrough and supplies the metal ions to the solid electrolyte membrane,
a surface of the positive electrode that is in contact with the solid electrolyte membrane has a film formation surface with a shape that conforms to a shape of a film formation region of the substrate, and a non-film formation surface other than the film formation surface, and
metal of the film formation surface is metal with a lower oxygen overvoltage than that of metal of the non-film formation surface.

4. A film formation device for forming a metal film, comprising at least:
a positive electrode;
a solid electrolyte membrane formed on a surface of the positive electrode, the solid electrolyte membrane being disposed between the positive electrode and a substrate to serve as a negative electrode; and
a power supply unit adapted to apply a voltage across the positive electrode and the substrate, wherein
a voltage is applied across the positive electrode and the substrate to deposit metal on a surface of the substrate from metal ions contained in the solid electrolyte membrane, so that a metal film made of the metal is formed,
the positive electrode is made of a porous body that allows a solution containing the metal ions to pass therethrough and supplies the metal ions to the solid electrolyte membrane, and
the solid electrolyte membrane contains hydrogen ions.

5. The film formation device for forming a metal film according to claim 1 , further comprising a metal ion supply unit for supplying a solution containing the metal ions to the positive electrode.

6. The film formation device for forming a metal film according to claim 3 , further comprising a metal ion supply unit for supplying a solution containing the metal ions to the positive electrode.

7. The film formation device for forming a metal film according to claim 4 , further comprising a metal ion supply unit for supplying a solution containing the metal ions to the positive electrode.

8. The film formation device for forming a metal film according to claim 3 , further comprising a pressure unit adapted to move the positive electrode toward the substrate, thereby pressing the solid electrolyte membrane against the substrate on which a film is to be formed.

9. The film formation device for forming a metal film according to claim 4 , further comprising a pressure unit adapted to move the positive electrode toward the substrate, thereby pressing the solid electrolyte membrane against the substrate on which a film is to be formed.

Assignees

• Hiraoka Motoki
• Yanagimoto Hiroshi
• Sato Yuki
• Yoshioka Takayasu
• Toyota Motor Co Ltd

Inventors

• Hiraoka Motoki
• Yanagimoto Hiroshi
• Sato Yuki
• Yoshioka Takayasu

Classifications

• C25D5/02

  Electroplating of selected surface areas · CPC title

• C25D5/022

  using masking means · CPC title

• C25D3/38

  of copper · CPC title

• C25D17/14

  for pad-plating · CPC title

• C25D17/005

  Contacting devices · CPC title