Film deposition device of metal film and film deposition method

Patent metadata

Field	Value
Publication number	US-9840786-B2
Application number	US-201414910365-A
Country	US
Kind code	B2
Filing date	Aug 4, 2014
Priority date	Aug 7, 2013
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

A film deposition device ( 1 A) of a metal film includes: a solid electrolyte membrane ( 13 ) that allows metal ions to be contained; a positive electrode ( 11 ) made of a porous body; a power supply part ( 14 ) that applies a voltage between the positive electrode and a base material; and a contact pressurization part ( 20 ) that comes into contact with the positive electrode ( 11 ) and uniformly pressurizes a film deposition region of a surface of the base material by the solid electrolyte membrane ( 13 ) via the positive electrode ( 11 ). The positive electrode ( 11 ) made of the porous body is capable of transmitting a solution containing the metal ions such that the metal ions are supplied to the solid electrolyte membrane. The power supply part ( 14 ) applies a voltage between the positive electrode and the base material so that the metal film made of the metal is deposited.

First claim

The invention claimed is:

1. A film deposition device of a metal film, comprising:
a solid electrolyte membrane that allows metal ions to be contained;
a positive electrode made of a porous body that is capable of transmitting a solution containing the metal ions such that the metal ions are supplied to the solid electrolyte membrane;
a power supply part that applies a voltage between the positive electrode and a base material in a state in which the solid electrolyte membrane is disposed on a surface of the positive electrode between the positive electrode and the base material to be a negative electrode such that a metal film made of metal is deposited by precipitating the metal from the metal ions on a surface of the base material; and
a contact pressurization part that uniformly pressurizes a film deposition region of the surface of the base material on which the metal film is deposited via the solid electrolyte membrane that is in contact with the positive electrode by the positive electrode.

2. The film deposition device according to claim 1 , further comprising:
a metal ion supply part that houses the positive electrode and supplies the solution to the positive electrode,
wherein the metal ion supply part includes a flow path that introduces the solution to the metal ion supply part, circulates the solution into the metal ion supply part, and discharges the solution from the metal ion supply part;
the contact pressurization part is disposed in the metal ion supply part; and
the positive electrode is disposed in the metal ion supply part such that a flow path through which the solution passes into the positive electrode is formed as a part of the flow path.

3. The film deposition device according to claim 1 , wherein the solid electrolyte membrane is a resin.

4. The film deposition device according to claim 1 , wherein the contact pressurization part is metal.

5. The film deposition device according to claim 1 , wherein each of surfaces of the film deposition region of the base material and the solid electrolyte membrane that faces the film deposition region is a flat surface.

6. A film deposition method of a metal film comprising:
sandwiching a solid electrolyte membrane with a positive electrode and a base material to be a negative electrode such that the solid electrolyte membrane comes into contact with the positive electrode and the base material;
containing metal ions in the solid electrolyte membrane;
depositing a metal film made of metal on a surface of the base material by precipitating the metal from the metal ions contained inside of the solid electrolyte membrane by applying a voltage between the positive electrode and the base material,
wherein, as the positive electrode, a porous body that is capable of transmitting a solution containing the metal ions is used such that the metal ions are supplied to the solid electrolyte membrane, and
when the metal film is deposited, a film deposition region on which the metal film of the surface of the base material is deposited is uniformly pressurized via the solid electrolyte membrane by the positive electrode.

7. The film deposition method according to claim 6 , further comprising disposing the solid electrolyte membrane on a surface of the positive electrode between the positive electrode and the base material prior to the step of sandwiching.

8. The film deposition method according to claim 6 , wherein the metal film is deposited while passing the solution into the positive electrode.

9. The film deposition method according to claim 6 , wherein the solid electrolyte membrane is a resin.

10. The film deposition method according to claim 6 , wherein each of surfaces of the film deposition region of the base material and the solid electrolyte membrane that faces the film deposition region is a flat surface.

Assignees

• Toyota Motor Co Ltd

Inventors

• Sato Yuki
• Yanagimoto Hiroshi
• Hiraoka Motoki

Classifications

• C25D5/08

  Electroplating with moving electrolyte e.g. jet electroplating {(using locally applied jets of electrolyte C25D5/026)} · CPC title

• C25D17/00

  Constructional parts, or assemblies thereof, of cells for electrolytic coating · CPC title

• C25D17/14

  for pad-plating · CPC title

• C25D17/10

  Electrodes {, e.g. composition, counter electrode} · CPC title

• C25D5/02

  Electroplating of selected surface areas · CPC title