Metal mask base, metal mask and method for producing metal mask

Patent metadata

Field	Value
Publication number	US-10903426-B2
Application number	US-201815869597-A
Country	US
Kind code	B2
Filing date	Jan 12, 2018
Priority date	Jul 17, 2015
Publication date	Jan 26, 2021
Grant date	Jan 26, 2021

Abstract

A metal mask substrate includes a metal obverse surface configured such that a resist is placed on the obverse surface. The obverse surface has a three-dimensional surface roughness Sa of less than or equal to 0.11 μm. The obverse surface also has a three-dimensional surface roughness Sz of less than or equal to 3.17 μm.

First claim

The invention claimed is:

1. A metal mask substrate comprising:
a metal obverse surface, the metal obverse surface being a first surface;
a first resist on the obverse surface;
a metal second surface, which is a surface opposite to the first surface; and
a second resist on the second surface, wherein
the obverse surface has a three-dimensional surface roughness Sa of less than or equal to 0.11 μm,
the obverse surface has a three-dimensional surface roughness Sz of less than or equal to 3.17 μm,
the second surface has a three-dimensional surface roughness Sa of less than or equal to 0.11 μm, and
the second surface has a three-dimensional surface roughness Sz of less than or equal to 3.17 μm.

2. The metal mask substrate according to claim 1 , wherein the obverse surface is made of Invar.

3. The metal mask substrate according to claim 1 , further comprising a metal layer, which is made of Invar, wherein
the obverse surface is an obverse surface of the metal layer, and
the metal mask substrate further comprises a polyimide layer, which faces a surface of the metal layer that is opposite to the obverse surface.

4. The metal mask substrate according to claim 1 , wherein
the first resist is a dry film resist, and
the obverse surface is configured such that the dry film resist is affixed to the obverse surface.

Assignees

• Toppan Printing Co Ltd

Inventors

• Fujito Daisei
• Nishitsuji Kiyoaki
• Nishi Takehiro

Classifications

• H10K71/166

  using selective deposition, e.g. using a mask · CPC title

• C23C14/042 Primary

  using masks · CPC title

• C23F1/02

  Local etching · CPC title

• C23F1/28

  for etching iron group metals · CPC title

• C23F1/04

  Chemical milling · CPC title