Cu core ball, solder joint, solder paste and formed solder
US-10888959-B2 · Jan 12, 2021 · US
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Patent family 65999156
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 65999156 |
| Family type | — |
| Earliest priority | Jun 12, 2018 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10888959B2 — Cu core ball, solder joint, solder paste and formed solder |
Representative publication
Best representative member for this family based on priority and filing country.
US10888959B2 — Cu core ball, solder joint, solder paste and formed solder (published Jan 12, 2021)
Member publications
Related publications in this family.
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
US-2019375053-A1 · Dec 12, 2019 · US