Method and system for a photonic interposer

Patent metadata

Field	Value
Publication number	US-10873399-B2
Application number	US-201916533541-A
Country	US
Kind code	B2
Filing date	Aug 6, 2019
Priority date	Sep 8, 2008
Publication date	Dec 22, 2020
Grant date	Dec 22, 2020

Abstract

Methods and systems for a photonic interposer may include receiving a continuous wave (CW) optical signal in a silicon photonic interposer from an optical source. A modulated optical signal may be generated by processing the received CW optical signal based on a first electrical signal received from an electronics die. A second electrical signal may be generated in the silicon photonic interposer based on the generated modulated optical signal, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of a processor core, a switch core, memory, or a router.

First claim

What is claimed is:

1. A method for communication, the method comprising:
receiving a continuous wave (CW) optical signal in a photonic interposer;
generating a first modulated optical signal in the photonic interposer by processing the CW optical signal based on a first electrical signal received from a complementary metal-oxide semiconductor (CMOS) electronics die;
communicating the first modulated optical signal out of the photonic interposer via a first optical fiber;

receiving a second modulated optical signal via a second optical fiber; and
generating a second electrical signal in the photonic interposer based on the second modulated optical signal.

2. The method according to claim 1 , further comprising communicating the second electrical signal to the CMOS electronics die via copper pillars.

3. The method according to claim 1 , further comprising generating the CW optical signal in an optical source assembly on the photonic interposer.

4. The method according to claim 3 , wherein the optical source assembly further comprises a semiconductor laser.

5. The method according to claim 1 , further comprising processing the CW optical signal via an optical modulator in the photonic interposer.

6. The method according to claim 5 , wherein the optical modulator further comprises a Mach-Zehnder interferometer modulator.

7. The method according to claim 1 , further comprising generating the second electrical signal in the photonic interposer via a photodetector integrated in the photonic interposer.

8. The method according to claim 1 , further comprising receiving the second modulated optical signal via grating couplers integrated in the photonic interposer.

9. The method according to claim 1 , wherein the electronics die further comprises a processor core, a switch core, memory, or a router.

10. An integrated optical communication system comprising a complementary metal-oxide semiconductor (CMOS) electronics die coupled to a photonic interposer, the integrated optical communication system being operable to:
receive a continuous wave (CW) optical signal in the photonic interposer;
generate a first modulated optical signal by processing the CW optical signal based on a first electrical signal received from the CMOS electronics die;
communicate the first modulated optical signal out of the photonic interposer via a first optical fiber;
receive a second modulated optical signal via a second optical fiber; and
generate a second electrical signal in the photonic interposer based on the second modulated optical signal.

11. The system according to claim 10 , wherein the integrated optical communication system is further operable to communicate the second electrical signal to the CMOS electronics die via copper pillars.

12. The system according to claim 10 , wherein the integrated optical communication system is further operable to generate the CW optical signal in an optical source assembly on the photonic interposer.

13. The system according to claim 12 , wherein the optical source assembly further comprises a semiconductor laser.

14. The system according to claim 10 , wherein the integrated optical communication system is further operable to process the CW optical signal via an optical modulator in the photonic interposer.

15. The system according to claim 14 , wherein the optical modulator further comprises a Mach-Zehnder interferometer modulator.

16. The system according to claim 10 , wherein the integrated optical communication system is further operable to generate the second electrical signal in the photonic interposer via a photodetector integrated in the photonic interposer.

17. The system according to claim 10 , wherein the integrated optical communication system is further operable to receive the CW optical signal via grating couplers integrated in the photonic interposer.

18. The system according to claim 10 , wherein the electronics die further comprises a processor core, a switch core, memory, or a router.

19. A system for communication, the system comprising:
an integrated optical communication system comprising a complementary metal-oxide semiconductor (CMOS) electronics die coupled to a photonic interposer, the integrated optical communication system being operable to:
receive a continuous wave (CW) optical signal in the photonics die from an optical source on the photonic interposer;
generate a first modulated optical signal by modulating the CW optical signal based on a first electrical signal received from the CMOS electronics die;
communicate the first modulated optical signal out of the photonic interposer via a first optical fiber;
receive a second modulated optical signal via a second optical fiber; and
generate a second electrical signal in the photonic interposer based on the second modulated optical signal.

Assignees

• Luxtera Llc

Inventors

• Peterson Mark
• Young Greg
• De Dobbelaere Peter

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/66

  Conductive materials thereof · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title