Method and system for a photonic interposer

Patent metadata

Field	Value
Publication number	US-10122463-B2
Application number	US-201715796063-A
Country	US
Kind code	B2
Filing date	Oct 27, 2017
Priority date	Sep 8, 2008
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

Methods and systems for a photonic interposer are disclosed and may include receiving one or more continuous wave (CW) optical signals in a silicon photonic interposer from an external optical source, from an optical source assembly via optical fibers coupled to the silicon photonic interposer. A modulated optical signal may be generated by processing the received CW optical signals based on a first electrical signal received from the electronics die. A second electrical signal may be generated in the silicon photonic interposer based on the generated modulated optical signals, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of: a processor core, a switch core, memory, or a router.

First claim

What is claimed is:

1. A method for communication, the method comprising:
in an integrated optical communication system comprising a complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer:
receiving a continuous wave (CW) optical signal in said silicon photonic interposer from an optical source coupled to said silicon photonic interposer via a first optical fiber;
generating a first modulated optical signal in said silicon photonic interposer by processing said received CW optical signal based on a first electrical signal received from one of said one or more CMOS electronics die;
communicating said first modulated optical signal out of said photonic interposer via a second optical fiber;
receiving a second modulated optical via a third optical fiber; and
generating a second electrical signal in said silicon photonic interposer based on said received second modulated optical signal.

2. The method according to claim 1 , comprising communicating said second electrical signal to said CMOS electronics die via copper pillars.

3. The method according to claim 1 , comprising generating said CW optical signal in an optical source assembly external to said silicon photonic interposer.

4. The method according to claim 1 , wherein said optical source assembly comprises a semiconductor laser.

5. The method according to claim 1 , comprising processing said received CW optical signal utilizing an optical modulator in said silicon photonic interposer.

6. The method according to claim 5 , wherein said optical modulator comprises a Mach-Zehnder interferometer modulator.

7. The method according to claim 1 , comprising generating said second electrical signal in said silicon photonic interposer a photodetector integrated in said silicon photonic interposer.

8. The method according to claim 1 , comprising receiving said CW optical source signal and said second modulated optical signal using grating couplers in said silicon photonic interposer.

9. The method according to claim 1 , wherein said electronics die comprises one or more of: a processor core, a switch core, memory, or a router.

10. The method according to claim 1 , wherein said integrated optical communication system comprises a plurality of transceivers.

11. A system for communication, the system comprising:
an integrated optical communication system comprising a complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer, said integrated optical communication system being operable to:
receive a continuous wave (CW) optical signal in said silicon photonic interposer from an optical source coupled to said silicon photonic interposer via a first optical fiber;
generate a first modulated optical signal by processing said received CW optical signal based on a first electrical signal received from said CMOS electronics die;
communicate said first modulated optical signal out of said photonic interposer via a second optical fiber;
receive a second modulated optical via a third optical fiber; and
generate a second electrical signal in said silicon photonic interposer based on said received second modulated optical signal.

12. The system according to claim 11 , wherein said integrated optical communication system is operable to communicate said second electrical signal to said CMOS electronics die via copper pillars.

13. The system according to claim 11 , wherein said integrated optical communication system is operable to generate said CW optical signal in an optical source assembly external to said silicon photonic interposer.

14. The system according to claim 13 , wherein said optical source assembly comprises a semiconductor laser.

15. The system according to claim 11 , wherein said integrated optical communication system is operable to process said received CW optical signal utilizing an optical modulator in said silicon photonic interposer.

16. The system according to claim 15 , wherein said optical modulator comprises a Mach-Zehnder interferometer modulator.

17. The system according to claim 11 , wherein said integrated optical communication system is operable to generate said second electrical signal in said silicon photonic interposer utilizing a photodetector integrated in said silicon photonic interposer.

18. The system according to claim 11 , wherein said integrated optical communication system is operable to receive said CW optical signal via grating couplers in said silicon photonic interposer.

19. The system according to claim 11 , wherein said electronics die comprises one or more of: a processor core, a switch core, memory, or a router.

20. A system for communication, the system comprising:
an integrated optical communication system comprising a complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer, said integrated optical communication system being operable to:
receive a continuous wave (CW) optical signal in said photonics die from an optical source coupled to said silicon photonic interposer via an optical fiber;
generate a first modulated optical signal by modulating said received CW optical signal based on a first electrical signal received from said CMOS electronics die;
communicate said first modulated optical signal out of said silicon photonic interposer via a second optical fiber;
receive a second modulated optical signal via a third optical fiber; and
generate a second electrical signal in said silicon photonic interposer based on said received second modulated optical signal.

Assignees

• Luxtera Inc

Inventors

• Peterson Mark
• Young Greg
• De Dobbelaere Peter

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/66

  Conductive materials thereof · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title