Multi-substrate electro-optical interconnection system

Patent metadata

Field	Value
Publication number	US-9391708-B2
Application number	US-201514714582-A
Country	US
Kind code	B2
Filing date	May 18, 2015
Priority date	May 21, 2014
Publication date	Jul 12, 2016
Grant date	Jul 12, 2016

Abstract

An intra-board chip-to-chip optical communications system has a high bit rate and high data throughput based on the use of a silicon photonic interposer. The system includes a multi-substrate electro-optical structure for communications with CMOS and/or BiCMOS IC chips of a PCB. The structure includes a multi-chip module primary substrate mounted over the supporting PCB. The multi-chip module primary substrate implements high frequency electrical interconnections between transceiver circuit chips, mounted on the silicon photonic interposer, and the IC chips.

First claim

The invention claimed is:

1. A system of intra-board, chip-to-chip communications for an electronic system comprising:
at least one printed circuit board (PCB);
at least one multi-chip module primary substrate comprising electrical interconnections electrically coupled to said at least one PCB and having a reserved area;
a plurality of IC chips mounted side-by-side around the reserved area of said at least one multi-chip module primary substrate, with each IC chip electrically coupled to said at least one multi-chip module primary substrate via the electrical interconnections;
a photonic waveguide silicon die mounted on the reserved area of said at least one multi-chip module primary substrate and to be optically coupled to at least one continuous wave laser source; and
a plurality of integrated transceiver circuit dies mounted to peripheral portions of said photonic waveguide silicon die, side-by-side with said plurality of IC chips;
said photonic waveguide silicon die comprising
optical signal modulation devices and optical signal detection devices defined therein and under a footprint of said plurality of integrated transceiver circuit dies and coupled to a respective IC chip,
at least one first optical waveguide network for distributing the continuous wave laser light to said optical modulation devices underneath said respective integrated transceiver circuit dies, and
a second waveguide network for interconnecting an output of at least one of said optical modulation devices underneath a respective one of said plurality of integrated transceiver circuit dies to said optical signal detection devices of another one of said plurality of integrated transceiver circuit dies.

2. The system of claim 1 , wherein said at least one multi-chip module primary substrate comprises:
a dielectric matrix material comprising at least one of silicon, a thermosetting resin, glass, and ceramic;
a plurality of metal vias in said dielectric matrix material; and
a plurality of patterned metal layer levels electrically coupled through the metal vias in said dielectric matrix material.

3. The system of claim 1 , wherein said second waveguide network comprises optical links to be coupled to optical I/O fibers for implementing inter-board communications among IC chips on different printed circuit boards (PCB) of the electronic system.

4. The system of claim 1 , wherein each optical modulation device comprises at least one of a Mach-Zender interferometer, a ring resonator and an Electro-Absorption modulator.

5. The system of claim 1 , wherein each optical signal detection device comprises a photodiode.

6. The system of claim 1 , wherein each integrated transceiver circuit comprises:
a driver circuit for respective optical modulation devices; and
a trans-impedance amplifier for electrical signals generated by said optical signal detection devices.

7. An electro-optical interconnection system comprising:
at least one printed circuit board (PCB);
at least one multi-chip module primary substrate comprising electrical interconnections electrically coupled to said at least one PCB;
a plurality of IC chips mounted on said at least one multi-chip module primary substrate, with each IC chip electrically coupled to said at least one multi-chip module primary substrate via the electrical interconnections;
a photonic waveguide silicon die mounted on said at least one multi-chip module primary substrate and to be optically coupled to at least one continuous wave laser source; and
a plurality of integrated transceiver circuit dies mounted on said photonic waveguide silicon die, side-by-side with said plurality of IC chips;
said photonic waveguide silicon die comprising
optical signal modulation devices and optical signal detection devices defined therein and under a footprint of said plurality of integrated transceiver circuit dies and coupled to a respective IC chip,
at least one first optical waveguide network for distributing the continuous wave laser light to said optical modulation devices underneath said respective integrated transceiver circuit dies, and
a second waveguide network for interconnecting an output of at least one of said optical modulation devices underneath a respective one of said plurality of integrated transceiver circuit dies to said optical signal detection devices of another one of said plurality of integrated transceiver circuit dies.

8. The electro-optical interconnection system of claim 7 , wherein said at least one multi-chip module primary substrate comprises:
a dielectric matrix material comprising at least one of silicon, a thermosetting resin, glass, and ceramic;
a plurality of metal vias in said dielectric matrix material; and
a plurality of patterned metal layer levels electrically coupled through the metal vias in said dielectric matrix material.

9. The electro-optical interconnection system of claim 7 , wherein said second waveguide network comprises optical links to be coupled to optical I/O fibers for implementing inter-board communications among IC chips on different printed circuit boards (PCB) of the system.

10. The electro-optical interconnection system of claim 7 , wherein each optical modulation device comprises at least one of a Mach-Zender interferometer, a ring resonator and an Electro-Absorption modulator.

11. The electro-optical interconnection system of claim 7 , wherein each optical signal detection device comprises a photodiode.

12. The electro-optical interconnection system of claim 7 , wherein each integrated transceiver circuit comprises:
a driver circuit for respective optical modulation devices; and
a trans-impedance amplifier for electrical signals generated by said optical signal detection devices.

13. A method for making an electro-optical interconnection system comprising:
forming at least one printed circuit board (PCB);
forming at least one multi-chip module primary substrate comprising electrical interconnections electrically coupled to the at least one PCB;
mounting a plurality of IC chips on the at least one multi-chip module primary substrate, with each IC chip electrically coupled to the at least one multi-chip module primary substrate via the electrical interconnections;
mounting a photonic waveguide silicon die on the at least one multi-chip module primary substrate, with the photonic waveguide silicon die to be optically coupled to at least one continuous wave laser source; and
mounting a plurality of integrated transceiver circuit dies on the photonic waveguide silicon die, side-by-side with the plurality of IC chips;
the photonic waveguide silicon die comprising
optical signal modulation devices and optical signal detection devices defined therein and under a footprint of the plurality of integrated transceiver circuit dies and coupled to a respective IC chip,
at least one first optical waveguide network for distributing the continuous wave laser light to the optical modulation devices underneath the respective integrated transceiver circuit dies, and
a second waveguide network for interconnecting an output of at least one of the optical modulation devices underneath a respective one of the plurality of integrated transceiver circuit dies to the optical signal detection devices of another one of the plurality of integrated transceiver circuit dies.

14. The method of claim 13 , wherein forming the at least one multi-chip module primary substrate comprises:
forming a dielectric matrix material comprising at least one of silicon, a thermosetting resin, glass, and ceramic;
forming a plurality of metal vies in the dielectric matrix material; and
form

Assignees

• St Microelectronics Srl

Inventors

• Fincato Antonio
• Rotolo Salvatore Mario
• Temporiti Milani Enrico Stefano
• Zuffada Maurizio

Classifications

• Y10T29/49131

  by utilizing optical sighting device · CPC title

• H04B10/801 Primary

  using optical interconnects, e.g. light coupled isolators, circuit board interconnections · CPC title

• H04B10/503

  Laser transmitters · CPC title

• H04B10/40 Primary

  Transceivers · CPC title

• H04B10/70

  Photonic quantum communication · CPC title