Method and system for hybrid integration of optical communication systems

Patent metadata

Field	Value
Publication number	US-9331096-B2
Application number	US-201213568406-A
Country	US
Kind code	B2
Filing date	Aug 7, 2012
Priority date	Sep 4, 2009
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

Methods and systems for hybrid integration of optical communication systems are disclosed and may include receiving continuous wave (CW) optical signals in a silicon photonics die (SPD) from an optical source external to the SPD. The received CW optical signals may be processed based on electrical signals received from an electronics die bonded to the SPD via metal interconnects. Modulated optical signals may be received in the SPD from optical fibers coupled to the SPD. Electrical signals may be generated in the SPD based on the received modulated optical signals and communicated to the electronics die via the metal interconnects. The CW optical signals may be received from an optical source assembly coupled to the SPD and/or from one or more optical fibers coupled to the SPD. The received CW optical signals may be processed utilizing one or more optical modulators, which may comprise Mach-Zehnder interferometer modulators.

First claim

What is claimed is:

1. A method for communication, the method comprising:
in a hybrid integration optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal interconnects:
receiving one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die;
processing said one or more received CW non-modulated optical signals based on electrical signals received from said one or more electronics die via said metal interconnects;
receiving modulated optical signals in said silicon photonics die from one or more optical fibers coupled to said silicon photonics die;
generating electrical signals in said silicon photonics die based on said received modulated optical signals; and
communicating said generated electrical signals to said one or more electronics die via said metal interconnects.

2. The method according to claim 1 , wherein said metal interconnects comprise copper pillars.

3. The method according to claim 1 , comprising receiving said one or more CW non-modulated optical signals from an optical source assembly coupled to said silicon photonics die.

4. The method according to claim 1 , comprising receiving said one or more CW non-modulated optical signals from one or more optical fibers coupled to said silicon photonics die.

5. The method according to claim 1 , comprising processing said one or more received CW non-modulated optical signals utilizing one or more optical modulators.

6. The method according to claim 5 , wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators.

7. The method according to claim 1 , comprising generating said electrical signals in said silicon photonics die utilizing one or more photodetectors integrated in said silicon photonics die.

8. The method according to claim 1 , comprising communicating optical signals into and/or out of said silicon photonics die utilizing grating couplers.

9. The method according to claim 1 , wherein said optical source comprises one or more semiconductor lasers.

10. The method according to claim 1 , wherein said hybrid integration optical communication system comprises a plurality of transceivers.

11. A system for communication, the system comprising:
a hybrid integration optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal interconnects, said hybrid integration optical communication system being operable to:
receive one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die;
process said one or more received CW non-modulated optical signals based on electrical signals received from said one or more electronics die via said metal interconnects;
receive modulated optical signals in said silicon photonics die from one or more optical fibers coupled to said silicon photonics die;
generate electrical signals in said silicon photonics die based on said received modulated optical signals; and
communicate said generated electrical signals to said one or more electronics die via said metal interconnects.

12. The system according to claim 11 , wherein said metal interconnects comprise copper pillars.

13. The system according to claim 11 , wherein said hybrid integration optical communication is operable to receive said one or more CW non-modulated optical signals from an optical source assembly coupled to said silicon photonics die.

14. The system according to claim 11 , wherein said hybrid integration optical communication is operable to receive said one or more CW non-modulated optical signals from one or more optical fibers coupled to said silicon photonics die.

15. The system according to claim 11 , wherein said hybrid integration optical communication is operable to process said one or more received CW non-modulated optical signals utilizing one or more optical modulators.

16. The system according to claim 15 , wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators.

17. The system according to claim 11 , wherein said hybrid integration optical communication is operable to generate said electrical signals in said silicon photonics die utilizing one or more photodetectors integrated in said silicon photonics die.

18. The system according to claim 11 , wherein said hybrid integration optical communication is operable to communicate optical signals into and/or out of said silicon photonics die utilizing grating couplers.

19. The system according to claim 11 , wherein said optical source comprises one or more semiconductor lasers.

20. A system for communication, the system comprising:
a hybrid integration optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal interconnects, said hybrid integration optical communication system being operable to:
receive one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die;
modulate said one or more received CW non-modulated optical signals based on electrical signals received from said one or more electronics die via said metal interconnects;
receive modulated optical signals in said silicon photonics die from one or more optical fibers coupled to said silicon photonics die;
generate electrical signals utilizing photodetectors in said silicon photonics die based on said received modulated optical signals; and
communicate said generated electrical signals to said one or more electronics die via said metal interconnects.

Assignees

• Pinguet Thierry
• Abdalla Sherif
• Peterson Mark
• Masini Gianlorenzo
• Dedobbelaere Peter
• Luxtera Inc

Inventors

• Pinguet Thierry
• Abdalla Sherif
• Peterson Mark
• Masini Gianlorenzo
• Dedobbelaere Peter

Classifications

• H10W90/297

  characterised by the through-semiconductor vias [TSVs] in the stacked chips · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00

  Package configurations · CPC title

• H10D88/00

  Three-dimensional [3D] integrated devices · CPC title

• H10D86/201

  the substrates comprising an insulating layer on a semiconductor body, e.g. SOI (H10D86/40 take precedence) · CPC title