Method and system for a photonic interposer

Patent metadata

Field	Value
Publication number	US-9356701-B2
Application number	US-201414475484-A
Country	US
Kind code	B2
Filing date	Sep 2, 2014
Priority date	Sep 8, 2008
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

Methods and systems for a photonic interposer are disclosed and may include receiving one or more continuous wave (CW) optical signals in a silicon photonic interposer from an optical source external to the silicon photonic interposer. The received CW optical signals may be processed based on electrical signals received from a CMOS electronics die bonded to the interposer, and modulated optical signals may be received in the interposer via optical couplers on the interposer. Electrical signals may be generated in the interposer based on the received modulated optical signals, and may be communicated to the CMOS electronics die. The generated electrical signals to may be communicated to the CMOS electronics die via copper pillars. The CW optical signals may be received in the interposer from an optical source assembly coupled to the interposer. The CW optical signals may be received from optical fibers coupled to the interposer.

First claim

What is claimed is:

1. A method for communication, the method comprising:
in an integrated optical communication system comprising one or more complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer:
receiving one or more continuous wave (CW) optical signals in said silicon photonic interposer from an optical source external to said silicon photonic interposer;
processing said one or more received CW optical signals based on electrical signals received from said one or more CMOS electronics die;
receiving modulated optical signals in said silicon photonic interposer via one or more optical couplers on said silicon photonic interposer;
generating electrical signals in said silicon photonic interposer based on said received modulated optical signals; and
communicating said generated electrical signals to said one or more CMOS electronics die.

2. The method according to claim 1 , comprising communicating said generated electrical signals to said one or more CMOS electronics die via copper pillars.

3. The method according to claim 1 , comprising receiving said one or more CW optical signals in said silicon photonic interposer from an optical source assembly coupled to said silicon photonic interposer.

4. The method according to claim 1 , comprising receiving said one or more CW optical signals from one or more optical fibers coupled to said silicon photonic interposer.

5. The method according to claim 1 , comprising processing said one or more received CW optical signals utilizing one or more optical modulators in said silicon photonic interposer.

6. The method according to claim 5 , wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators.

7. The method according to claim 1 , comprising generating said electrical signals in said silicon photonic interposer utilizing one or more photodetectors integrated in said silicon photonic interposer.

8. The method according to claim 1 , wherein said one or more optical couplers on said silicon photonic interposer comprise grating couplers.

9. The method according to claim 1 , wherein said one or more electronics die comprise one or more of: a processor core, a switch core, or router.

10. The method according to claim 1 , wherein said integrated optical communication system comprises a plurality of transceivers.

11. A system for communication, the system comprising:
an integrated optical communication system comprising one or more complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer, said integrated optical communication system being operable to:
receive one or more continuous wave (CW) optical signals in said silicon photonic interposer from an optical source external to said silicon photonic interposer;
process said one or more received CW optical signals based on electrical signals received from said one or more CMOS electronics die;
receive modulated optical signals in said silicon photonic interposer via optical couplers on said silicon photonic interposer;
generate electrical signals in said silicon photonic interposer based on said received modulated optical signals; and
communicate said generated electrical signals to said one or more CMOS electronics die.

12. The system according to claim 11 , wherein said integrated optical communication system is operable to communicate said generated electrical signals to said one or more CMOS electronics die via copper pillars.

13. The system according to claim 11 , wherein said hybrid integration optical communication system is operable to receive said one or more CW optical signals in said silicon photonic interposer from an optical source assembly coupled to said silicon photonic interposer.

14. The system according to claim 11 , wherein said hybrid integration optical communication system is operable to receive said one or more CW optical signals from one or more optical fibers coupled to said silicon photonic interposer.

15. The system according to claim 11 , wherein said hybrid integration optical communication system is operable to process said one or more received CW optical signals utilizing one or more optical modulators in said silicon photonic interposer.

16. The system according to claim 15 , wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators.

17. The system according to claim 11 , wherein said hybrid integration optical communication system is operable to generate said electrical signals in said silicon photonic interposer utilizing one or more photodetectors integrated in said silicon photonic interposer.

18. The system according to claim 11 , wherein said one or more optical couplers on said silicon photonic interposer comprise grating couplers.

19. The system according to claim 11 , wherein said one or more electronics die comprise one or more of: a processor core, a switch core, or router.

20. A system for communication, the system comprising:
an integrated optical communication system comprising one or more complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer, said integrated optical communication system being operable to:
receive one or more continuous wave (CW) optical signals in said photonics die from an optical source coupled to said silicon photonic interposer via one or more optical fibers;
process said one or more received CW optical signals based on electrical signals received from said one or more CMOS electronics die;
receive modulated optical signals in said silicon photonic interposer via optical couplers on said silicon photonic interposer;
generate electrical signals in said silicon photonic interposer based on said received modulated optical signals; and
communicate said generated electrical signals to said one or more CMOS electronics die.

Assignees

• Luxtera Inc

Inventors

• Peterson Mark
• Young Greg
• De Dobbelaere Peter

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/66

  Conductive materials thereof · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title