Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
US-10791631-B2 · Sep 29, 2020 · US
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Patent family 62243746
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 62243746 |
| Family type | — |
| Earliest priority | Dec 6, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10791631B2 — Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device |
Representative publication
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US10791631B2 — Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device (published Sep 29, 2020)
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