Three-dimensional semiconductor memory devices

Patent metadata

Field	Value
Publication number	US-10777572-B2
Application number	US-201816192859-A
Country	US
Kind code	B2
Filing date	Nov 16, 2018
Priority date	Apr 30, 2018
Publication date	Sep 15, 2020
Grant date	Sep 15, 2020

Abstract

A three-dimensional (3D) semiconductor memory device includes a source structure disposed on a horizontal semiconductor layer and including a first source conductive pattern and a second source conductive pattern which are sequentially stacked on the horizontal semiconductor layer, an electrode structure including a plurality of electrodes vertically stacked on the source structure, and a vertical semiconductor pattern penetrating the electrode structure and the source structure, wherein a portion of a sidewall of the vertical semiconductor pattern is in contact with the source structure. The first source conductive pattern includes a discontinuous interface at a level between a top surface of the horizontal semiconductor layer and a bottom surface of the second source conductive pattern.

First claim

What is claimed is:

1. A three-dimensional (3D) semiconductor memory device comprising:
a source structure on a horizontal semiconductor layer, the source structure comprising a first source conductive pattern and a second source conductive pattern which are sequentially stacked on the horizontal semiconductor layer;
an electrode structure comprising a plurality of electrodes vertically stacked on the source structure; and
a vertical semiconductor pattern penetrating the electrode structure, the second source conductive pattern and the first source conductive pattern,
wherein a first portion of a sidewall of the vertical semiconductor pattern is horizontally spaced apart from the second source conductive pattern,
wherein a second portion of the sidewall of the vertical semiconductor pattern is in contact with the first source conductive pattern,
wherein the first source conductive pattern includes a discontinuous interface at a level between a top surface of the horizontal semiconductor layer and a bottom surface of the second source conductive pattern, and
wherein the discontinuous interface is enclosed by the first source conductive pattern.

2. The 3D semiconductor memory device of claim 1 ,
wherein the discontinuous interface is spaced apart from the top surface of the horizontal semiconductor layer by a first distance and is spaced apart from the bottom surface of the second source conductive pattern by a second distance different from the first distance.

3. The 3D semiconductor memory device of claim 1 ,
wherein the discontinuous interface is closer to the top surface of the horizontal semiconductor layer than to the bottom surface of the second source conductive pattern.

4. The 3D semiconductor memory device of claim 1 ,
wherein a distance between the discontinuous interface and the top surface of the horizontal semiconductor layer is equal to a distance between the discontinuous interface and the bottom surface of the second source conductive pattern.

5. The 3D semiconductor memory device of claim 1 ,
wherein the discontinuous interface is laterally spaced apart from the vertical semiconductor pattern.

6. The 3D semiconductor memory device of claim 1 ,
wherein the first source conductive pattern comprises:
a lower portion adjacent to the top surface of the horizontal semiconductor layer;
an upper portion adjacent to the bottom surface of the second source conductive pattern; and
a sidewall portion surrounding the second portion of the sidewall of the vertical semiconductor pattern and extending from an upper surface of the upper portion to a region between the second source conductive pattern and the vertical semiconductor pattern,
wherein the sidewall portion is interposed between the second source conductive pattern and the vertical semiconductor pattern.

7. The 3D semiconductor memory device of claim 6 ,
wherein the first source conductive pattern includes a semiconductor material doped with charge carrier impurities, and
wherein the lower portion and the upper portion have different crystal structures from each other in the first source conductive pattern.

8. The 3D semiconductor memory device of claim 6 ,
wherein the first source conductive pattern includes a semiconductor material doped with charge carrier impurities, and
wherein the lower portion and the upper portion have the same crystal structure in the first source conductive pattern.

9. The 3D semiconductor memory device of claim 6 ,
wherein the horizontal semiconductor layer includes single-crystalline silicon or poly- crystalline silicon, and
wherein the lower portion of the first source conductive pattern includes amorphous silicon or single-crystalline silicon.

10. The 3D semiconductor memory device of claim 6 ,
wherein the upper portion of the first source conductive pattern includes amorphous or poly-crystalline silicon, and
wherein the second source conductive pattern includes poly-crystalline silicon.

11. The 3D semiconductor memory device of claim 6 ,
wherein the bottom surface of the second source conductive pattern is vertically spaced apart from the top surface of the horizontal semiconductor layer by a first distance, and
wherein one sidewall of the second source conductive pattern is horizontally spaced apart from one sidewall of the vertical semiconductor pattern by a second distance less than the first distance.

12. The 3D semiconductor memory device of claim 1 ,
wherein the first and second source conductive patterns include a semiconductor material doped with charge carrier impurities having a first conductivity type, and
wherein a concentration of the charge carrier impurities in the first source conductive pattern is greater than a concentration of the charge carrier impurities in the second source conductive pattern.

13. The 3D semiconductor memory device of claim 1 , further comprising:
a source plug disposed on sidewalls of the electrode structure and the source structure and connected to the horizontal semiconductor layer; and
an insulating spacer disposed between the source plug and the electrode structure,
wherein the discontinuous interface is laterally spaced apart from the vertical semiconductor pattern and the source plug.

14. The 3D semiconductor memory device of claim 1 , further comprising:
a data storage pattern vertically extending between the vertical semiconductor pattern and the electrode structure,
wherein a bottom surface of the data storage pattern is in contact with a portion of the first source conductive pattern.

15. The 3D semiconductor memory device of claim 14 ,
wherein the bottom surface of the data storage pattern is located at a level between a bottom surface of a lowermost one of the electrodes and the bottom surface of the second source conductive pattern.

16. A three-dimensional (3D) semiconductor memory device comprising:
a source structure on a horizontal semiconductor layer, the source structure comprising a first source conductive pattern and a second source conductive pattern which are sequentially stacked on the horizontal semiconductor layer;
an electrode structure comprising a plurality of electrodes stacked on the source structure; and
a vertical semiconductor pattern penetrating the electrode structure, the second source conductive pattern and the first source conductive pattern in a direction perpendicular to a top surface of the horizontal semiconductor layer,
wherein a first portion of a sidewall of the vertical semiconductor pattern is horizontally spaced apart from the second source conductive pattern,
wherein a second portion of the sidewall of the vertical semiconductor pattern is in contact with the first source conductive pattern of the source structure,
wherein the first source conductive pattern comprises:
a lower portion adjacent to a top surface of the horizontal semiconductor layer; and
an upper portion adjacent to a bottom surface of the second source conductive pattern,
wherein the upper portion and the lower portion have different crystal structures from each other.

17. The 3D semiconductor memory device of claim 16 ,
wherein the first source conductive pattern further comprises:
a sidewall portion which extends from the upper and lower portions in the direction perpendicular to the top surface of the horizontal semiconductor layer and surrounds the second portion of the sidewall of the vertical semiconductor pattern.

18. The 3D semiconductor memory device of claim 17 ,
wherein a top surface of the sidewall portion is located at a l

Assignees

• Samsung Electronics Co Ltd

Inventors

• JUNG Euntaek
• Shin Joongshik
• Yun Jihye

Classifications

• H10D64/0113

  the conductive layers comprising highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers · CPC title

• H10W20/435

  Cross-sectional shapes or dispositions of interconnections · CPC title

• H10W20/42

  Vias, e.g. via plugs · CPC title

• H10W20/4451

  Semiconductor materials, e.g. polysilicon · CPC title

• H10W20/43

  Layouts of interconnections · CPC title