Three dimensional NAND device containing dielectric pillars for a buried source line and method of making thereof

Patent metadata

Field	Value
Publication number	US-9799670-B2
Application number	US-201615017961-A
Country	US
Kind code	B2
Filing date	Feb 8, 2016
Priority date	Nov 20, 2015
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

A three-dimensional memory device includes an alternating stack of electrically conductive layers and insulating layers located over a substrate, an array of memory stack structures, each memory stack structure extending through the alternating stack and including a memory film and a semiconductor channel laterally surrounded by the memory film, and an array of dielectric pillars located between the alternating stack and the substrate.

First claim

What is claimed is:

1. A three-dimensional memory device comprising:
an alternating stack of electrically conductive layers and insulating layers located over a substrate;
an array of memory stack structures, each memory stack structure extending through the alternating stack and including a memory film and a semiconductor channel laterally surrounded by the memory film;
an array of dielectric pillars located between the alternating stack and the substrate; and
a continuous source structure including a source conductive layer that laterally surrounds each dielectric pillar in the array of dielectric pillars, wherein the three-dimensional memory device comprises at least one feature selected from:
a first feature that the continuous source structure comprises a metallic dielectric liner contacting sidewalls of the array of dielectric pillars and extending above a topmost surface of the alternating stack, and a conductive fill material portion surrounded by in the metallic dielectric liner;
a second feature that the three-dimensional memory device further comprises a stepped surface region in which end portions of the electrically conductive lavers form stepped surfaces, wherein the source conductive layer laterally extends farther than the electrically conductive layers; and
a third feature that the continuous source structure contacts at least one of an outer sidewall of an annular source region and an annular bottom surface of the memory film, and the three-dimensional memory device further comprises a dielectric cam plate underlying the semiconductor channel and comprising a same set of dielectric materials as the memory film.

2. The three-dimensional memory device of claim 1 , wherein:
the source conductive layer extends horizontally between the substrate and the alternating stack parallel to the top surface of the substrate;
the continuous source structure further includes a source conductive via structure that extends vertically through the alternating stack perpendicular to the top surface of the substrate; and
the continuous source structure is an integral structure without an interface between the source conductive via structure and the source conductive layer.

3. The three-dimensional memory device of claim 1 , wherein the array of dielectric pillars comprises silicon oxide.

4. The three-dimensional memory device of claim 1 , further comprising:
a lower source insulator layer located between the substrate and the source conductive layer;
an upper source insulator layer located between the source conductive layer and the alternating stack; and
an insulating spacer laterally surrounding the source conductive via structure.

5. The three-dimensional memory device of claim 1 , wherein the three-dimensional memory device comprises the first feature.

6. The three-dimensional memory device of claim 1 , wherein the three-dimensional memory device comprises the second feature.

7. The three-dimensional memory device of claim 1 , wherein the three-dimensional memory device comprises the third feature.

8. The three-dimensional memory device of claim 1 , wherein each dielectric pillar in the array of dielectric pillars has a topmost surface located at, or underneath, a first horizontal plane including a bottommost surface of the alternating stack, and has a bottommost surface located at, or above, a second horizontal plane including a top surface of the substrate.

9. The three-dimensional memory device of claim 1 , wherein the array of dielectric pillars and the array of memory stack structures collectively constitute a two-dimensional periodic array of multiple instances of a unit cell structure that includes multiple memory stack structures and at least one dielectric pillar.

10. The three-dimensional memory device of claim 1 , wherein the array of dielectric pillars comprises a zigzag row array, a lattice array or a diagonal line array of the dielectric pillars.

11. The three-dimensional memory device of claim 9 , wherein the array of memory stack structures comprise an hexagonal array of memory stack structures, and a ratio of a total number of the multiple memory stack structures in the unit cell structure to a total number of the at least one dielectric pillar in the unit cell structure is in a range from 2 to 4.

12. The three-dimensional memory device of claim 1 , wherein:
the three-dimensional memory device comprises a vertical NAND device located over the substrate;
the electrically conductive layers comprise, or are electrically connected to, a respective word line of the NAND device;
the substrate comprises a silicon substrate;
the vertical NAND device comprises an array of monolithic three-dimensional NAND strings over the silicon substrate;
at least one memory cell in a first device level of the array of monolithic three-dimensional NAND strings is located over another memory cell in a second device level of the array of monolithic three-dimensional NAND strings;
the silicon substrate contains an integrated circuit comprising a driver circuit for the memory device located thereon; and
the array of monolithic three-dimensional NAND strings comprises:
a plurality of semiconductor channels, wherein at least one end portion of each of the plurality of semiconductor channels extends substantially perpendicular to a top surface of the substrate;
a plurality of charge storage elements, each charge storage element located adjacent to a respective one of the plurality of semiconductor channels; and
a plurality of control gate electrodes having a strip shape extending substantially parallel to the top surface of the substrate, the plurality of control gate electrodes comprise at least a first control gate electrode located in the first device level and a second control gate electrode located in the second device level.

13. A three-dimensional memory device comprising:
an alternating stack of electrically conductive layers and insulating layers located over a substrate;
an array of memory stack structures, each memory stack structure extending through the alternating stack and including a memory film and a semiconductor channel laterally surrounded by the memory film; and
an array of dielectric pillars located between the alternating stack and the substrate, wherein the array of dielectric pillars comprises a zigzag row array, a lattice array or a diagonal line array of the dielectric pillars.

14. The three-dimensional memory device of claim 13 , further comprising a continuous source structure including a source conductive layer that laterally surrounds each dielectric pillar in the array of dielectric pillars.

15. The three-dimensional memory device of claim 14 , wherein:
the source conductive layer extends horizontally between the substrate and the alternating stack parallel to the top surface of the substrate;
the continuous source structure further includes a source conductive via structure that extends vertically through the alternating stack perpendicular to the top surface of the substrate; and
the continuous source structure is an integral structure without an interface between the source conductive via structure and the source conductive layer.

16. The three-dimensional memory device of claim 14 , wherein the array of dielectric pillars comprises silicon oxide.

17. The three-dimensional memory device of claim 14 , further comprising:
a lower source insulator layer located between the substrate and the source conductive layer;
an upper source insulator layer located between the source conductive layer and the alternating stack; and

Assignees

• Sandisk Technologies Inc
• Sandisk Technologies Llc

Inventors

• Nishikawa Masatoshi
• Liu Jin
• Ge Chun
• Zhang Yanli

Classifications

• H01L21/28282

  Electricity · mapped topic

• H01L27/11573

  Electricity · mapped topic

• H01L27/11582

  Electricity · mapped topic

• H01L29/7926

  Electricity · mapped topic

• H01L27/1157 Primary

  Electricity · mapped topic