Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Electronic component module and method for manufacturing the same
US9113571B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9113571-B2 |
| Application number | US-201313920375-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 18, 2013 |
| Priority date | Jun 22, 2012 |
| Publication date | Aug 18, 2015 |
| Grant date | Aug 18, 2015 |
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Abstract
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In a bond portion between an electrical conductive land and a connection terminal member, an intermetallic compound producing region in which at least a Cu—Sn-based, an M-Sn-based (M indicates Ni and/or Mn), and a Cu-M-Sn-based intermetallic compound are produced is arranged so as to be present at a connection terminal member side. In this intermetallic compound producing region, when a cross section of the bond portion is equally defined into 10 boxes in a longitudinal direction and a lateral direction to define 100 boxes in total, a ratio of the number of boxes in each of which at least two types of intermetallic compounds having different constituent elements are present to the total number of boxes other than boxes in each of which only a Sn-based metal component is present is about 70% or more.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing an electronic component module, the method comprising the steps of: preparing a circuit board including a first primary surface and a second primary surface and provided on at least the first primary surface with an electrical conductive land; preparing an electronic component; preparing a columnar connection terminal member including a first end surface and a second end surface, a surface of the connection terminal member bein…
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Frequently asked questions
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- What does patent US9113571B2 cover?
- In a bond portion between an electrical conductive land and a connection terminal member, an intermetallic compound producing region in which at least a Cu—Sn-based, an M-Sn-based (M indicates Ni and/or Mn), and a Cu-M-Sn-based intermetallic compound are produced is arranged so as to be present at a connection terminal member side. In this intermetallic compound producing region, when a cross s…
- Who is the assignee on this patent?
- Murata Manufacturing Co
- What technology area does this patent fall under?
- Primary CPC classification H10W70/60. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 18 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).