Tape attaching machine and tape removing method

Patent metadata

Field	Value
Publication number	US-10707104-B2
Application number	US-201816015719-A
Country	US
Kind code	B2
Filing date	Jun 22, 2018
Priority date	Jun 28, 2017
Publication date	Jul 7, 2020
Grant date	Jul 7, 2020

Abstract

A tape attaching machine for attaching an adhesive tape to a frame and a wafer and cutting the adhesive tape along the frame is provided. The tape attaching machine includes a tape winding unit configured to wind a remaining part of the adhesive tape left after cutting the adhesive tape, the remaining part of the adhesive tape being not attached to the frame and the wafer. The tape winding unit includes a main shaft like a roller and a pair of jigs detachably mounted on the opposite ends of the main shaft. Each of the jigs is engageable with the main shaft so as to have a tape contact area around which the remaining part of the adhesive tape is adapted to be wound and a grip area formed axially outside the tape contact area and adapted to be gripped by an operator.

First claim

What is claimed is:

1. A tape attaching machine comprising:
a tape supply portion in which an adhesive tape is mounted in the form of a roll;
a tape attaching movable roller for attaching said adhesive tape to a frame and a wafer;
a tape cutter for cutting said adhesive tape along said frame; and
a tape winding unit configured to wind a remaining part of said adhesive tape left after cutting said adhesive tape, said remaining part of said adhesive tape being not attached to said frame and said wafer,
said tape winding unit including:
a main shaft; and
a pair of jigs detachably mounted on opposite ends of said main shaft,
each of said jigs being engageable with said main shaft, wherein each of said jigs includes a tape contact area around which said remaining part of said adhesive tape is adapted to be wound and a grip area formed axially outside said tape contact area and adapted to be gripped by an operator, said tape contact area having a diameter larger than a diameter of said main shaft.

2. The tape attaching machine according to claim 1 , wherein a slit is formed on an outer circumferential surface of each jig.

3. A tape attaching machine comprising:
a tape supply portion in which an adhesive tape unit is mounted in the form of a roll, said adhesive tape unit being composed of an adhesive tape having an adhesive surface and a release paper attached to said adhesive surface of said adhesive tape;
a separating portion for separating said adhesive tape unit into said adhesive tape and said release paper;
a release paper winding unit configured to wind said release paper;
a tape attaching movable roller for attaching said adhesive tape to a frame and a wafer;
a tape cutter for cutting said adhesive tape along said frame; and
a tape winding unit configured to wind a remaining part of said adhesive tape left after cutting said adhesive tape, said remaining part of said adhesive tape being not attached to said frame and said wafer,
said tape winding unit including:
a first main shaft; and
a pair of first jigs detachably mounted on opposite ends of said first main shaft,
each of said first jigs being engageable with said first main shaft, wherein each of said first jigs includes a tape contact area around which said remaining part of said adhesive tape is adapted to be wound and a grip area formed axially outside said tape contact area and adapted to be gripped by an operator, said tape contact area having a diameter larger than a diameter of said first main shaft,

said release paper winding unit including:
a second main shaft; and
a pair of second jigs detachably mounted on opposite ends of said second main shaft,
each of said second jigs being engageable with said second main shaft, wherein each of said second jigs includes a release paper contact area around which said release paper is adapted to be wound and a grip area formed axially outside said release paper contact area and adapted to be gripped by said operator, said release paper contact area having a diameter larger than a diameter of said second main shaft.

4. The tape attaching machine according to claim 3 , wherein a slit is formed on an outer circumferential surface of each of the pair of first jigs and/or the pair of second jigs.

5. A tape removing method in a tape attaching machine including:
a tape supply portion in which an adhesive tape is mounted in a form of a roll;
a tape attaching movable roller for attaching said adhesive tape to a frame and a wafer;
a tape cutter for cutting said adhesive tape along said frame; and
a tape winding unit configured to wind a remaining part of said adhesive tape left after cutting said adhesive tape, said remaining part of said adhesive tape being not attached to said frame and said wafer,
said tape winding unit including:
a main shaft; and
a pair of jigs detachably mounted on opposite ends of said main shaft,
each of said jigs being engageable with said main shaft, wherein each of said jigs includes a tape contact area around which said remaining part of said adhesive tape is adapted to be wound and a grip area formed axially outside said tape contact area and adapted to be gripped by an operator, said tape contact area having a diameter larger than a diameter of said main shaft,

said tape removing method comprising:
a jig removing step of removing at least one of said jigs engaged with the opposite ends of said main shaft from said main shaft; and
a tape removing step of removing the roll of said remaining part of said adhesive tape wound around said main shaft from said main shaft after performing said jig removing step.

6. The tape removing method according to claim 5 , wherein a slit is formed on an outer circumferential surface of each jig.

Assignees

• Disco Corp

Inventors

• Hao Yilong

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/0442 Primary

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title