Ruthenium metal feature fill for interconnects

Patent metadata

Field	Value
Publication number	US-10700009-B2
Application number	US-201816147928-A
Country	US
Kind code	B2
Filing date	Oct 1, 2018
Priority date	Oct 4, 2017
Publication date	Jun 30, 2020
Grant date	Jun 30, 2020

Abstract

A method is provided for void-free Ru metal filling of features in a substrate. The method includes providing a substrate containing features, depositing a Ru metal layer in the features, removing the Ru metal layer from a field area around an opening of the features, and depositing additional Ru metal in the features, where the additional Ru metal is deposited in the features at a higher rate than on the field area. According to one embodiment, the additional Ru metal is deposited until the features are fully filled with Ru metal.

First claim

What is claimed is:

1. A method for ruthenium (Ru) metal filling, the method comprising:
providing a substrate containing features having a sidewall and a bottom, the sidewall including an area of retrograde profile relative to a direction extending from a top of the features to the bottom of the features;
depositing a Ru metal layer in the features,
removing the Ru metal layer from a field area around an opening of the features; and
depositing additional Ru metal in the features, wherein the additional Ru metal is deposited in the features at a higher rate than on the field area.

2. The method of claim 1 , wherein the additional Ru metal is deposited until the features are fully filled with Ru metal.

3. The method of claim 1 , wherein the removing includes exposing the substrate to a plasma-excited dry etching process.

4. The method of claim 3 , wherein the plasma-excited dry etching process includes exposing the substrate to a plasma-excited etching gas containing an oxygen-containing gas and optionally a halogen-containing gas.

5. The method of claim 3 , wherein the plasma-excited dry etching process includes exposing the substrate to a plasma-excited etching gas containing an oxygen-containing gas and a halogen-containing gas, the oxygen-containing gas containing O 2 , H 2 O, CO, CO 2 , or a combination thereof, and the halogen-containing gas containing Cl 2 , BCl 3 , CF 4 , or a combination thereof.

6. The method of claim 1 , further comprising:
prior to depositing the Ru metal layer, forming a nucleation layer in the features, wherein the nucleation layer is selected from the group consisting of Mo, MoN, Ta, TaN, TaAlN, W, WN, Ti, TiN, and TiAlN.

7. The method of claim 1 , wherein the Ru metal layer and the additional Ru metal are deposited by atomic layer deposition (ALD) or chemical vapor deposition (CVD).

8. The method of claim 7 , wherein the Ru metal layer is conformally deposited by CVD using Ru 3 (CO) 12 and CO carrier gas.

9. The method of claim 1 , further comprising heat-treating the substrate to reflow the Ru metal layer in the features.

10. The method of claim 9 , wherein the heat-treating is performed at a substrate temperature between 200° C. and 600° C.

11. A method for ruthenium (Ru) metal filling, the method comprising:
providing a substrate containing features having a sidewall and a bottom, the sidewall including an area of retrograde profile relative to a direction extending from a top of the features to the bottom of the features;
depositing a Ru metal layer in the features, wherein depositing the Ru metal layer pinches off the feature openings before the features are filled with the Ru metal layer, thereby forming voids inside the features;
removing excess Ru metal that caused the pinch-off, wherein the removing removes the Ru metal layer from a field area around an opening of the features; and
depositing additional Ru metal in the features, wherein the additional Ru metal is deposited in the features at a higher rate than on the field area.

12. The method of claim 11 , wherein the additional Ru metal is deposited until the features are fully filled with Ru metal.

13. The method of claim 11 , wherein the removing includes exposing the substrate to a plasma-excited dry etching process.

14. The method of claim 13 , wherein the plasma-excited dry etching process includes exposing the substrate to a plasma-excited etching gas containing an oxygen-containing gas and optionally a halogen-containing gas.

15. The method of claim 11 , further comprising:
prior to depositing the Ru metal layer, forming a nucleation layer in the feature, wherein the nucleation layer is selected from the group consisting of Mo, MoN, Ta, TaN, TaAlN, W, WN, Ti, TiN, and TiAlN.

16. The method of claim 11 , wherein the Ru metal layer and the additional Ru metal are deposited by atomic layer deposition (ALD) or chemical vapor deposition (CVD).

17. The method of claim 16 , wherein the Ru metal layer is conformally deposited by CVD using Ru 3 (CO) 12 and CO carrier gas.

18. The method of claim 11 , further comprising heat-treating the substrate to reflow the Ru metal layer in the feature.

19. The method of claim 18 , wherein the heat-treating is performed at a substrate temperature between 200° C. and 600° C.

20. A method for ruthenium (Ru) metal filling, the method comprising:
providing a substrate containing features;
depositing a Ru metal layer in the features;
removing the Ru metal layer from a field area around an opening of the features, wherein the removing includes exposing the substrate to a plasma-excited dry etching process that includes exposing the substrate to a plasma-excited etching gas containing an oxygen-containing gas and optionally a halogen-containing gas; and
depositing additional Ru metal in the features, wherein the additional Ru metal is deposited in the features at a higher rate than on the field area.

Assignees

• Tokyo Electron Ltd

Inventors

• Yu Kai-Hung
• Joy Nicholas
• Liu Eric Chih Fang
• O'Meara David L
• Rosenthal David
• Igeta Masanobu
• Wajda Cory
• Leusink Gerrit J

Classifications

• H10W20/0595

  by using multiple deposition steps separated by etching steps · CPC title

• H10P52/403

  of conductive or resistive materials · CPC title

• H10P50/267

  using plasmas · CPC title

• H10P14/418

  the conductive layers comprising transition metals · CPC title

• H10W20/4441

  the principal metal being a refractory metal · CPC title