Substrate processing apparatus, substrate processing method and storage medium

Patent metadata

Field	Value
Publication number	US-10649335-B2
Application number	US-201615760206-A
Country	US
Kind code	B2
Filing date	Aug 26, 2016
Priority date	Sep 15, 2015
Publication date	May 12, 2020
Grant date	May 12, 2020

Abstract

A substrate processing method, includes acquiring a height distribution along a radial direction of a substrate in a peripheral edge portion of a front surface of the substrate, forming an underlayer film on the entire front surface of the substrate so as to correct a drop of a height of the peripheral edge portion based on the height distribution, and forming a resist film on the entire surface of the underlayer film.

First claim

What is claimed is:

1. A substrate processing method, comprising:
acquiring a height distribution along a radial direction of a substrate in a peripheral edge portion of a front surface of the substrate;
forming an underlayer film on the entire front surface of the substrate so as to correct a drop of a height of the peripheral edge portion based on the height distribution; and
forming a resist film on the entire surface of the underlayer film.

2. The method of claim 1 , wherein the acquiring the height distribution is performed based on a first image data acquired by capturing an image of a side end portion of the substrate mounted on a first mounting part using a first imaging mechanism.

3. The method of claim 2 , wherein the acquiring the height distribution is performed by detecting a vertical shift of an end portion of the substrate mounted on the first mounting part with respect to a reference position.

4. The method of claim 3 , wherein the detecting the positional shift is performed based on a second image data acquired by capturing an image of a side surface of the substrate mounted on the first mounting part using a second imaging mechanism.

5. The method of claim 1 , wherein the forming the underlayer film includes:
a chemical liquid supply process of supplying a chemical liquid for formation of the underlayer film to a central portion of a front surface of a substrate mounted on a second mounting part provided in a cup;
a rotation process of rotating the second mounting part to spread the chemical liquid to a peripheral edge portion of the front surface of the substrate by a centrifugal force and to dry the chemical liquid; and
an adjustment process of adjusting a drying speed of the chemical liquid in the peripheral edge portion of the substrate according to the height distribution during the rotation process.

6. The method of claim 5 , wherein the adjustment process includes an exhaust process of exhausting an interior of the cup at an exhaust amount corresponding to the height distribution.

7. The method of claim 5 , wherein the adjustment process includes a process of locally heating the peripheral edge portion of the substrate so as to obtain a temperature corresponding to the height distribution.

8. The method of claim 5 , wherein the adjustment process includes a process of disposing a baffle member provided above the substrate at a height corresponding to the height distribution.

9. A substrate processing apparatus, comprising:
a height distribution acquisition module configured to acquire a height distribution along a radial direction of a substrate in a peripheral edge portion of a front surface of the substrate; and
an underlayer film forming module configured to form an underlayer film, which is provided under a resist film, on the entire front surface of the substrate so as to correct a drop of a height of the peripheral edge portion based on the height distribution.

10. The apparatus of claim 9 , wherein the height distribution acquisition module includes a first mounting part configured to mount the substrate, and a first imaging mechanism configured to acquire a first image data by capturing an image of a side end portion of the substrate mounted on the first mounting part, and
a calculation part configured to acquire the height distribution based on the first image data is provided.

11. The apparatus of claim 10 , wherein the height distribution acquisition module includes a position shift detection mechanism configured to detect a vertical shift of an end portion of the substrate mounted on the first mounting part with respect to a reference position, and
the calculation part is configured to acquire the height distribution based on the position shift.

12. The apparatus of claim 11 , wherein the position shift detection mechanism includes a second imaging mechanism configured to acquire a second image data by capturing an image of a side surface of the substrate mounted on the first mounting part, and
the calculation part is configured to acquire the height distribution based on the second image data.

13. The apparatus of claim 9 , wherein the underlayer film forming module includes:
a second mounting part provided in a cup and configured to mount the substrate;
a nozzle configured to supply a chemical liquid for formation of the underlayer film to a central portion of a front surface of the substrate;
a rotation mechanism configured to rotate the second mounting part to spread the chemical liquid to a peripheral edge portion of the substrate by a centrifugal force and configured to dry the chemical liquid to form the underlayer film; and
an adjustment mechanism configured to adjust a drying speed of the chemical liquid in the peripheral edge portion of the substrate according to the height distribution during rotation of the substrate.

14. A non-transitory computer-readable storage medium storing a computer program used for a substrate processing apparatus configured to form an underlayer film, which is provided under a resist film, on a substrate,
wherein the program incorporates processes for executing the substrate processing method of claim 1 .

Assignees

• Tokyo Electron Ltd

Inventors

• Kodama Teruhiko
• Enomoto Masashi
• Tadokoro Masahide
• Hashimoto Takafumi

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P76/2043

  using an anti-reflective coating · CPC title

• H10P76/20

  of masks comprising organic materials · CPC title

• H10P72/3402

  Mechanical parts of transfer devices · CPC title