Chip electronic component and manufacturing method thereof
US-9945042-B2 · Apr 17, 2018 · US
High aspect ratio electroplated structures and anisotropic electroplating processes
US10640879B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10640879-B2 |
| Application number | US-201715817049-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 17, 2017 |
| Priority date | Nov 18, 2016 |
| Publication date | May 5, 2020 |
| Grant date | May 5, 2020 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.
First claim
Opening claim text (preview).
What is claimed is: 1. A circuit comprising: a substrate; and at least one trace including a metal crown portion formed over at least a portion of the trace, the metal crown formed on a top surface and sidewalls of the portion of the trace, the metal crown having a final height to width aspect ratio greater than an initial height to width aspect ratio of the trace. 2. The circuit of claim 1 , wherein the circuit is formed on a flexure. 3. The circuit of claim 1 , wherein the metal crown portion is formed on a portion of the trace that is not over the substrate. 4. The circuit of claim 1 , wherein the metal crown portion is formed on the portion of the trace to tune the impedance of the trace. 5. A circuit comprising: a substrate; and at least one trace including a metal crown portion formed over at least a portion of the trace to mechanically strengthen the at least one trace, the metal crown formed on a top surface and sidewalls of the portion of the trace, the metal crown having a final height to width aspect ratio greater than an initial height to width aspect ratio of the trace. 6. The circuit of claim 5 , wherein the at least one trace including the metal crown portion formed over at least the portion of the trace to mechanically strengthen the at least one trace is strengthened for a bonding or joining operation. 7. The circuit of claim 5 , wherein the at least one trace is formed on a flexure.
Assignees
Inventors
Classifications
- C25D5/02Primary
Electroplating of selected surface areas · CPC title
Electroplating using modulated, pulsed or reversing current · CPC title
Electroplating, e.g. finish plating · CPC title
by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence) · CPC title
- H05K3/241Primary
characterised by the electroplating method; means therefor, e.g. baths or apparatus · CPC title
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- What does patent US10640879B2 cover?
- Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio…
- Who is the assignee on this patent?
- Hutchinson Technology
- What technology area does this patent fall under?
- Primary CPC classification C25D5/02. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue May 05 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).