High aspect ratio electroplated structures and anisotropic electroplating processes
US-12378687-B2 · Aug 5, 2025 · US
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Patent family 62144325
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 62144325 |
| Family type | — |
| Earliest priority | Nov 18, 2016 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US12378687B2 — High aspect ratio electroplated structures and anisotropic electroplating processes |
Representative publication
Best representative member for this family based on priority and filing country.
US12378687B2 — High aspect ratio electroplated structures and anisotropic electroplating processes (published Aug 5, 2025)
Member publications
Related publications in this family.
High aspect ratio electroplated structures and anisotropic electroplating processes
US-2020232112-A1 · Jul 23, 2020 · US
High aspect ratio electroplated structures and anisotropic electroplating processes
US-10640879-B2 · May 5, 2020 · US
High Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes
US-2018142370-A1 · May 24, 2018 · US