System and method for controllable non-volatile metal removal

Patent metadata

Field	Value
Publication number	US-10633743-B2
Application number	US-201815980953-A
Country	US
Kind code	B2
Filing date	May 16, 2018
Priority date	Mar 13, 2015
Publication date	Apr 28, 2020
Grant date	Apr 28, 2020

Abstract

A system and method for removing metal from a substrate in a controlled manner is disclosed. The system includes a chamber, with one or more gas inlets to allow the flow of gasses into the chamber, at least one exhaust pump, to exhaust gasses from the chamber, and a heater, capable of modifying the temperature of the chamber. In some embodiments, one or more gasses are introduced into the chamber at a first temperature. The atoms in these gasses chemically react with the metal on the surface of the substrate to form a removable compound. The gasses are then exhausted from the chamber, leaving the removable compound on the surface of the substrate. The temperature of the chamber is then elevated to a second temperature, greater than the sublimation temperature of the removable compound. This increased temperature allows the removable compound to become gaseous and be exhausted from the chamber.

First claim

What is claimed is:

1. A method of removing metal from a substrate, comprising:
chemically reacting one or more processing gasses with metal disposed on the substrate at a first temperature to form a removable compound, where the removable compound sublimes at a sublimation temperature, and wherein the first temperature is less than the sublimation temperature;
subliming the removable compound while no further chemical reactions occur between the one or more processing gasses and the metal disposed on the substrate, so that the removable compound becomes gaseous, wherein a temperature of the subliming is a second temperature greater than the sublimation temperature; and
eliminating the gaseous removable compound from a surface of the substrate.

2. The method of claim 1 , further comprising repeating the chemically reacting, subliming and eliminating a plurality of times until a desired amount of metal is removed from the substrate.

3. The method of claim 1 , wherein the metal comprises platinum.

4. The method of claim 3 , wherein the one or more processing gasses comprise chlorine and carbon monoxide and the removable compound comprises chlorinated platinum carbonyl (Pt(CO) 2 Cl 2 ).

5. A method of removing metal from a substrate, comprising:
chemically reacting metal disposed on the substrate with a first processing gas at a first temperature to form a precursor of a removable compound, where the removable compound sublimes at a sublimation temperature, and wherein the first temperature is less than the sublimation temperature;
reacting the precursor with a second processing gas at a second temperature to form the removable compound while no further chemical reactions occur between the first processing gasses and the metal disposed on the substrate;
subliming the removable compound so that the removable compound becomes gaseous; and
eliminating the gaseous removable compound from the surface of the substrate.

6. The method of claim 5 , further comprising repeating the reacting with the first processing gas, reacting with the second processing gas, subliming and eliminating a plurality of times until a desired amount of metal is removed from the substrate.

7. The method of claim 5 , wherein the metal comprises platinum.

8. The method of claim 7 , wherein the first processing gas comprises chlorine and the second processing gas comprises carbon monoxide.

9. The method of claim 8 , wherein the removable compound comprises chlorinated platinum carbonyl (Pt(CO) 2 Cl 2 ).

10. The method of claim 8 , wherein the precursor comprises platinum chloride (PtCl 2 ).

Assignees

• Varian Semiconductor Equipment Ass Inc

Inventors

• Chen Tsung-Liang
• Schmiege Benjamin
• Anthis Jeffrey W
• Gilchrist Glen

Classifications

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H01J37/32449

  Gas control, e.g. control of the gas flow · CPC title

• B05B17/00

  Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups (dropping or releasing powdered, liquid or gaseous matter in flight B64D1/16) · CPC title

• C23C18/1295

  with after-treatment of the deposited inorganic material · CPC title