Heat exchanger for regulating surface temperature of a polishing pad, polishing apparatus, polishing method, and medium storing computer program

Patent metadata

Field	Value
Publication number	US-10589398-B2
Application number	US-201815883978-A
Country	US
Kind code	B2
Filing date	Jan 30, 2018
Priority date	Feb 2, 2017
Publication date	Mar 17, 2020
Grant date	Mar 17, 2020

Abstract

A heat exchanger which can allow a surface temperature of a polishing pad to promptly reach a target temperature and can realize a uniform distribution of the surface temperature of the polishing pad is disclosed. The heat exchanger includes a pad contact surface capable of contacting the polishing pad, a heating flow passage through which a heating fluid is to flow, and a cooling flow passage through which a cooling fluid is to flow. The heating flow passage and the cooling flow passage are arranged side by side from beginnings to ends thereof, and the heating flow passage and the cooling flow passage cross each other at different levels at a peripheral portion of the pad contact surface.

First claim

What is claimed is:

1. A heat exchanger for regulating a surface temperature of a polishing pad by contacting a surface of the polishing pad, comprising:
a pad contact surface capable of contacting the polishing pad;
a heating flow passage through which a heating fluid is to flow; and
a cooling flow passage through which a cooling fluid is to flow,
wherein the heating flow passage and the cooling flow passage are arranged side by side from beginnings to ends thereof, and the heating flow passage and the cooling flow passage cross each other at different levels at a peripheral portion of the pad contact surface.

2. The heat exchanger according to claim 1 , wherein the heating flow passage and the cooling flow passage comprise zigzag passages.

3. The heat exchanger according to claim 2 , wherein folded-back portions of the heating flow passage and folded-back portions of the cooling flow passage overlap each other.

4. The heat exchanger according to claim 2 , wherein folded-back portions of the heating flow passage and folded-back portions of the cooling flow passage are located right above the peripheral portion of the pad contact surface.

5. A polishing apparatus comprising:
a rotatable polishing table for supporting a polishing pad;
a polishing head configured to press a substrate against a surface of the polishing pad so as to polish the substrate;
a heat exchanger configured to contact the surface of the polishing pad so as to regulate a surface temperature of the polishing pad;
a heating-fluid supply pipe configured to supply a heating fluid to the heat exchanger; and
a cooling-fluid supply pipe configured to supply a cooling fluid to the heat exchanger, the heating exchanger comprising a heating exchanger according to claim 1 .

6. A substrate polishing method comprising:
holding a substrate with a polishing head; and
pressing the substrate by the polishing head against a surface of a polishing pad to polish the substrate, while placing a heat exchanger, through which a heating fluid and a cooling fluid flow, in contact with the surface of the polishing pad so as to regulate a surface temperature of the polishing pad, the heat exchanger comprising a heat exchanger according to claim 1 .

7. A non-transitory computer-readable storage medium storing therein a program that instructs a computer to perform a substrate polishing method recited in claim 6 , the computer being configured to control operations of a polishing apparatus.

Assignees

• Ebara Corp

Inventors

• Eto Yohei
• Maruyama Toru

Classifications

• B24B49/14

  taking regard of the temperature during grinding · CPC title

• B24B55/02

  Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant (cooling or lubricating during dressing operation B24B53/095; incorporated in grinding wheels B24D) · CPC title

• F28F2210/10

  Particular layout, e.g. for uniform temperature distribution · CPC title

• B24B37/107

  in a rotary movement only, about an axis being stationary during lapping · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title