Cleaning flux, cleaning solder paste, and solder joint
US-10259083-B2 · Apr 16, 2019 · US
Flux
US10583533B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10583533-B2 |
| Application number | US-201715999473-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 16, 2017 |
| Priority date | Feb 18, 2016 |
| Publication date | Mar 10, 2020 |
| Grant date | Mar 10, 2020 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Provided is a flux that is able to suppress any solder bridges even when it is applied to the narrow pitched electrodes such that the bridge occurs when using the past flux. The flux is characterized by containing 15% by mass or more and 35% by mass or less of polyoxyalkylene ethylenediamine, 2% by mass or more and 15% by mass or less of an organic acid, 10% by mass or more and 30% by mass or less of a base material, 3% by mass or more and 30% by mass or less of an amine and 20% by mass or more and 40% by mass or less of a solvent.
First claim
Opening claim text (preview).
The invention claimed is: 1. A flux comprising: 15% by mass or more and 35% by mass or less of polyoxyalkylene ethylenediamine, 2% by mass or more and 15% by mass or less of an organic acid, 10% by mass or more and 30% by mass or less of a base material, 3% by mass or more and 30% by mass or less of an amine and 20% by mass or more and 40% by mass or less of a solvent. 2. The flux of claim 1 , wherein the polyoxyalkylene ethylenediamine is at least one of polyoxypropylene ethylenediamine, polyoxyethylene ethylenediamine, polyoxymethylethylene ethylenediamine or polyoxyethylene polyoxypropylene ethylenediamine.
Assignees
Inventors
Classifications
Electric or electronic devices · CPC title
with organic compounds as principal constituents · CPC title
- B23K35/362Primary
Selection of compositions of fluxes (B23K35/365, B23K35/368 take precedence) · CPC title
Additives containing two or more different additives of the same subgroup in C08K · CPC title
N-compounds · CPC title
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- What does patent US10583533B2 cover?
- Provided is a flux that is able to suppress any solder bridges even when it is applied to the narrow pitched electrodes such that the bridge occurs when using the past flux. The flux is characterized by containing 15% by mass or more and 35% by mass or less of polyoxyalkylene ethylenediamine, 2% by mass or more and 15% by mass or less of an organic acid, 10% by mass or more and 30% by mass or l…
- Who is the assignee on this patent?
- Senju Metal Industry Co
- What technology area does this patent fall under?
- Primary CPC classification B23K35/362. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Mar 10 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).