Cleaning flux, cleaning solder paste, and solder joint

Patent metadata

Field	Value
Publication number	US-10259083-B2
Application number	US-201314917363-A
Country	US
Kind code	B2
Filing date	Sep 12, 2013
Priority date	Sep 12, 2013
Publication date	Apr 16, 2019
Grant date	Apr 16, 2019

Abstract

A cleaning flux contains as a solvent 60-98% by weight of one or both of an alkylene oxide-resorcinol copolymer and an ethylene oxide-propylene oxide condensation-added alkylene diamine. An addition amount of the alkylene oxide-resorcinol copolymer is within a range of 0-98% by weight and the addition amount of the ethylene oxide-propylene oxide condensation-added alkylene diamine is within the range of 0-98% by weight. The cleaning flux further includes one or both of an organic acid and a halogen compound. The addition amount of the organic acid is within the range of 0-18% by weight and the addition amount of the halogen compound is within the range of 0-4% by weight.

First claim

The invention claimed is:

1. A flux comprising a solvent having a polarity of dissolving a flux component and a boiling point of 330° C. or higher wherein a volatilization volume occurred at a reflow soldering process is equal to or less than 20% of the whole flux volume, and
wherein the solvent comprises:
23-65% by weight of an alkylene oxide-resorcinol copolymer, based on the total weight of the flux;
15-68% by weight of an ethylene oxide-propylene oxide condensation-added alkylene diamine, based on the total weight of the flux; and
one or both of an organic acid and a halogen compound, wherein an addition amount of the organic acid is 2-18% by weight based on the total weight of the flux and an addition amount of the halogen compound is 1-4% by weight based on the total weight of the flux,
wherein the total amount of the alkylene oxide-resorcinol copolymer and the ethylene oxide-propylene oxide condensation-added alkylene diamine is 68-98% by weight, based on the total weight of the flux.

2. The flux according to claim 1 , further comprising 0-30% by weight of a thixotropic agent, based on the total weight of the flux and 0-15% by weight of rosin, based on the total weight of the flux.

3. A solder paste comprising a mixture comprising the flux of claim 1 and solder alloy powder.

4. The solder paste according to claim 3 , further comprising 5-30% by weight of a thixotropic agent, based on the total weight of the flux and 0-15% by weight of rosin, based on the total weight of the flux.

5. A flux comprising a solvent having a polarity of dissolving a flux component and a boiling point of 330° C. or higher wherein a volatilization volume occurred at a reflow soldering process is equal to or less than 20% of the whole flux volume, and
wherein the solvent comprises:
68-98% by weight of an ethylene oxide-propylene oxide condensation-added alkylene diamine, based on the total weight of the flux; and
one or both of an organic acid and a halogen compound, wherein an addition amount of the organic acid is 2-18% by weight based on the total weight of the flux and an addition amount of the halogen compound is 1-4% by weight based on the total weight of the flux.

6. The flux according to claim 5 , further comprising 0-30% by weight of a thixotropic agent, based on the total weight of the flux and 0-15% by weight of rosin, based on the total weight of the flux.

Assignees

• Senju Metal Industry Co

Inventors

• Kojima Naokatsu
• MARUKO Daisuke

Classifications

• B23K35/0244

  Powders, particles or spheres; Preforms made therefrom · CPC title

• B23K35/3612

  with organic compounds as principal constituents · CPC title

• B23K35/025

  Pastes, creams or slurries · CPC title

• B23K35/3613

  Polymers, e.g. resins · CPC title

• B23K35/0222

  for use in soldering or brazing (B23K35/0205 takes precedence) · CPC title