Flux for soldering and solder paste composition
US-9844840-B2 · Dec 19, 2017 · US
with organic compounds as principal constituents
with organic compounds as principal constituents · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K35/3612 |
| Official title | {with organic compounds as principal constituents} |
| Display label | with organic compounds as principal constituents |
| Total patents | 246 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 19 |
| 2016 | 25 |
| 2017 | 37 |
| 2018 | 26 |
| 2019 | 31 |
| 2020 | 24 |
| 2021 | 22 |
| 2022 | 12 |
| 2023 | 20 |
| 2024 | 13 |
| 2025 | 14 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Flux for Rapid Heating Method and Solder Paste for Rapid Heating Method
US-2017355042-A1 · Dec 14, 2017 · US
Welding electrode
US-9821414-B2 · Nov 21, 2017 · US
Flux composition and techniques for use thereof
US-9815149-B2 · Nov 14, 2017 · US
Boric Acid Free Flux
US-2017304962-A1 · Oct 26, 2017 · US
Composite nanometal paste containing copper filler and joining method
US-9796052-B2 · Oct 24, 2017 · US
Thermally decomposable polymer compositions for forming microelectronic assemblies
US-9757818-B2 · Sep 12, 2017 · US
Flux formulations
US-9751159-B2 · Sep 5, 2017 · US
Toughened solder for downhole applications, methods of manufacture thereof and articles comprising the same
US-9707642-B2 · Jul 18, 2017 · US
Boric acid free flux
US-9700964-B2 · Jul 11, 2017 · US
Flux-Coated Ball and Method of Manufacturing the Same
US-2017182601-A1 · Jun 29, 2017 · US
Solder Paste
US-2017157691-A1 · Jun 8, 2017 · US
Nickel particle composition, bonding material, and bonding method in which said material is used
US-2017136585-A1 · May 18, 2017 · US
Paste and process for forming a solderable polyimide-based polymer thick film conductor
US-9649730-B2 · May 16, 2017 · US
Paste and process for forming a solderable polyimide-based polymer thick film conductor
US-2017043435-A1 · Feb 16, 2017 · US
Thermally decomposable polymer compositions for forming microelectronic assemblies
US-2017036308-A1 · Feb 9, 2017 · US
Flux and method for manufacturing semiconductor device
US-2016354871-A1 · Dec 8, 2016 · US
Thermally decomposable polymer compositions for forming microelectronic assemblies
US-9505948-B2 · Nov 29, 2016 · US
Flux for soldering and solder composition
US-2016332262-A1 · Nov 17, 2016 · US
Braze for ceramic and ceramic matrix composite components
US-2016325368-A1 · Nov 10, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K35/3612?
- CPC B23K35/3612 is the Cooperative Patent Classification code for “with organic compounds as principal constituents.”
- How many patents are filed under CPC B23K35/3612 (with organic compounds as principal constituents)?
- Our database includes 246 publications tagged with this CPC code.
- Is patent activity under CPC B23K35/3612 growing?
- Publication counts under this code: 13 in 2024 vs 14 in 2025 (latest complete years).