Flux and solder paste
US-12502735-B2 · Dec 23, 2025 · US
N-compounds
N-compounds · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K35/3615 |
| Official title | {N-compounds} |
| Display label | N-compounds |
| Total patents | 60 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 2 |
| 2017 | 8 |
| 2018 | 5 |
| 2019 | 6 |
| 2020 | 9 |
| 2021 | 5 |
| 2022 | 7 |
| 2023 | 4 |
| 2024 | 6 |
| 2025 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Conductive paste for bonding
US-2025269473-A1 · Aug 28, 2025 · US
Flux and solder paste
US-2025262692-A1 · Aug 21, 2025 · US
Flux and method for producing assembly
US-12304008-B2 · May 20, 2025 · US
Non-aqueous solder flux composition
US-12285825-B2 · Apr 29, 2025 · US
Flux and solder paste
US-12220771-B2 · Feb 11, 2025 · US
Flux, resin flux cored solder using the flux, and soldering method
US-12172243-B2 · Dec 24, 2024 · US
Flux and method for producing assembly
US-2024326176-A1 · Oct 3, 2024 · US
Flux and solder paste
US-2024261908-A1 · Aug 8, 2024 · US
Alloy
US-2024247340-A1 · Jul 25, 2024 · US
Flux, solder paste, and electronic circuit board
US-12011787-B2 · Jun 18, 2024 · US
Flux and solder paste
US-11931829-B2 · Mar 19, 2024 · US
Solder alloy, solder paste, solder ball, solder preform, solder joint, on-board electronic circuit, ECU electronic circuit, on-board electronic circuit device, and ECU electronic circuit device
US-11819955-B2 · Nov 21, 2023 · US
Rosin-modified product, flux composition, liquid flux, flux cored solder and solder paste
US-11794288-B2 · Oct 24, 2023 · US
Solder composition and electronic substrate
US-11780035-B2 · Oct 10, 2023 · US
Flux and solder paste
US-2023256547-A1 · Aug 17, 2023 · US
Lead-free solder material, layer structure, method of forming a solder material, and method of forming a layer structure
US-2022355422-A1 · Nov 10, 2022 · US
Flux, resin flux cored solder, and flux coated pellet
US-11413711-B2 · Aug 16, 2022 · US
Solder alloy, solder paste, solder ball, solder preform, solder joint, on-board electronic circuit, ecu electronic circuit, on-board electronic circuit device, and ecu electronic circuit device
US-2022250194-A1 · Aug 11, 2022 · US
Non-aqueous solder flux composition
US-2022226940-A1 · Jul 21, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K35/3615?
- CPC B23K35/3615 is the Cooperative Patent Classification code for “N-compounds.”
- How many patents are filed under CPC B23K35/3615 (N-compounds)?
- Our database includes 60 publications tagged with this CPC code.
- Is patent activity under CPC B23K35/3615 growing?
- Publication counts under this code: 6 in 2024 vs 6 in 2025 (latest complete years).