Flux and solder paste
US-2024278360-A1 · Aug 22, 2024 · US
Cleaning Flux, Cleaning Solder Paste, and Solder Joint
US2016221128A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016221128-A1 |
| Application number | US-201314917363-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 12, 2013 |
| Priority date | Sep 12, 2013 |
| Publication date | Aug 4, 2016 |
| Grant date | — |
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- Title
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Abstract
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A cleaning flux contains as a solvent 60-98% by weight of one or both of an alkylene oxide-resorcinol copolymer and an ethylene oxide-propylene oxide condensation-added alkylene diamine. An addition amount of the alkylene oxide-resorcinol copolymer is within a range of 0-98% by weight and the addition amount of the ethylene oxide-propylene oxide condensation-added alkylene diamine is within the range of 0-98% by weight. The cleaning flux further includes one or both of an organic acid and a halogen compound. The addition amount of the organic acid is within the range of 0-18% by weight and the addition amount of the halogen compound is within the range of 0-4% by weight.
First claim
Opening claim text (preview).
1 . A cleaning flux comprising a solvent having a polarity of dissolving a flux component and a boiling point of 330° C. or higher wherein a volatilization volume occurred at a reflow soldering process is equal to or less than 20% of the whole flux volume. 2 . The cleaning flux according to claim 1 , comprising as the solvent 60-98% by weight of one or both of an alkylene oxide-resorcinol copolymer and an ethylene oxide-propylene oxide condensation-added alkylene diamine wherein an addition amount of the alkylene oxide-resorcinol copolymer is within a range of 0-98% by weight and an addition amount of the ethylene oxide-propylene oxide condensation-added alkylene diamine is within the range of 0-98% by weight; and the cleaning flux further comprises one or both of an organic acid and a halogen compound wherein an addition amount of the organic acid is within the range of 0-18% by weight and an addition amount of the halogen compound is within the range of 0-4% by weight. 3 . The cleaning flux according to claim 1 , further comprising 0-30% by weight of a thixotropic agent and 0-15% by weight of rosin. 4 . A cleaning solder paste comprising a mixture comprising cleaning flux and solder alloy powder, wherein the flux comprises a solvent having a polarity of dissolving a flux component and having a boiling point of 330° C. or higher, and a volatilization volume occurred in a reflow soldering process is equal to or less than 20% of the whole flux. 5 . The cleaning solder paste according to claim 4 , wherein the cleaning flux comprises as the solvent 60-93% by weight of one or both of an alkylene oxide-resorcinol copolymer and an ethylene oxide-propylene oxide condensation-added alkylene diamine wherein an addition amount of the alkylene oxide-resorcinol copolymer is 0-93% by weight and an addition amount of the ethylene oxide-propylene oxide condensation-added alkylene diamine is within the range of 0-93% by weight; and the cleaning flux further comprises one or both of an organic acid and a halogen compound wherein an addition amount of the organic acid is within the range of 0-18% by weight and an addition amount of the halogen compound is within the range of 0-4% by weight. 6 . The cleaning solder paste according to claim 4 , further comprising 5-30% by weight of a thixotropic agent and 0-15% by weight of rosin. 7 . A solder joint wherein the joint is formed by using the cleaning flux of claim 1 . 8 . The solder joint according to claim 7 , wherein the joint is formed by using a cleaning solder paste comprising a mixture comprising cleaning flux and solder alloy powder, wherein the flux comprises a solvent having a polarity of dissolving a flux component and having a boiling point of 330° C. or higher, and a volatilization volume occurred in a reflow soldering process is equal to or less than 20% of the whole flux. 9 . The cleaning flux according to claim 2 , further comprising 0-30% by weight of a thixotropic agent and 0-15% by weight of rosin. 10 . The cleaning solder paste according to claim 5 , further comprising 5-30% by weight of a thixotropic agent and 0-15% by weight of rosin. 11 . The solder joint according to claim 7 , wherein the cleaning flux comprises as the solvent 60-98% by weight of one or both of an alkylene oxide-resorcinol copolymer and an ethylene oxide-propylene oxide condensation-added alkylene diamine wherein an addition amount of the alkylene oxide-resorcinol copolymer is within a range of 0-98% by weight and an addition amount of the ethylene oxide-propylene oxide condensation-added alkylene diamine is within the range of 0-98% by weight; and the cleaning flux further comprises one or both of an organic acid and a halogen compound wherein an addition amount of the organic acid is within the range of 0-18% by weight and an addition amount of the halogen compound is within the range of 0-4% by weight. 12 . The solder joint according to claim 7 , wherein the cleaning flux further comprises 0-30% by weight of a thixotropic agent and 0-15% by weight of rosin. 13 . The solder joint according to claim 8 , wherein the cleaning flux comprises as the solvent 60-93% by weight of one or both of an alkylene oxide-resorcinol copolymer and an ethylene oxide-propylene oxide condensation-added alkylene diamine wherein an addition amount of the alkylene oxide-resorcinol copolymer is 0-93% by weight and an addition amount of the ethylene oxide-propylene oxide condensation-added alkylene diamine is within the range of 0-93% by weight; and the cleaning flux further comprises one or both of an organic acid and a halogen compound wherein an addition amount of the organic acid is within the range of 0-18% by weight and an addition amount of the halogen compound is within the range of 0-4% by weight. 14 . The solder joint according to claim 8 , wherein the cleaning solder paste further comprises 5-30% by weight of a thixotropic agent and 0-15% by weight of rosin.
Assignees
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Classifications
Powders, particles or spheres; Preforms made therefrom · CPC title
Polymers, e.g. resins · CPC title
with organic compounds as principal constituents · CPC title
containing aromatic or arylaliphatic hydroxyl groups · CPC title
Pastes, creams or slurries · CPC title
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- What does patent US2016221128A1 cover?
- A cleaning flux contains as a solvent 60-98% by weight of one or both of an alkylene oxide-resorcinol copolymer and an ethylene oxide-propylene oxide condensation-added alkylene diamine. An addition amount of the alkylene oxide-resorcinol copolymer is within a range of 0-98% by weight and the addition amount of the ethylene oxide-propylene oxide condensation-added alkylene diamine is within the…
- Who is the assignee on this patent?
- Senju Metal Industry Co
- What technology area does this patent fall under?
- Primary CPC classification B23K35/362. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Aug 04 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).