Method for manufacturing light-emitting device

Patent metadata

Field	Value
Publication number	US-10580932-B2
Application number	US-201715849123-A
Country	US
Kind code	B2
Filing date	Dec 20, 2017
Priority date	Dec 21, 2016
Publication date	Mar 3, 2020
Grant date	Mar 3, 2020

Abstract

A method for manufacturing a light-emitting device includes: providing a light-transmissive member comprising: a base portion, and a projecting portion on a first surface side of the base portion; providing a light-emitting element that has a main emitting surface and an electrode formation surface opposite to the main emitting surface; disposing the light-emitting element on the projecting portion of the light-transmissive member such that the main emitting surface of the light-emitting element faces an upper surface of the projecting portion of the light-transmissive member; and forming a light-reflective member that covers at least one of (i) lateral surfaces of the light-emitting element, and/or (ii) lateral surfaces of the projecting portion of the light-transmissive member.

First claim

What is claimed is:

1. A method for manufacturing a light-emitting device, the method comprising:
providing a light-transmissive member comprising:
a base portion, and
a projecting portion on a first surface side of the base portion,
wherein a base material for the light-transmissive member comprises a layered structure that includes:
at least one phosphor-containing portion, and
at least one phosphor-free portion comprising substantially no phosphor particles, and

wherein the projecting portion comprises the phosphor-containing portion and a part of the phosphor-free portion;

providing a light-emitting element that has a main emitting surface and an electrode formation surface opposite to the main emitting surface;
disposing the light-emitting element on the projecting portion of the light-transmissive member such that the main emitting surface of the light-emitting element faces an upper surface of the projecting portion of the light-transmissive member; and
forming a light-reflective member that covers (i) lateral surfaces of the light-emitting element, (ii) lateral surfaces of the projecting portion of the light-transmissive member, and (iii) the first surface of the base portion, wherein the light-reflective member is in contact with at least the lateral surfaces of the projecting portion of the light-transmissive member and the first surface of the base portion.

2. The method for manufacturing a light-emitting device according to claim 1 ,
wherein the light-transmissive member comprises a plurality of projecting portions connected to each other via the base portion; and
wherein the method further comprises:
removing the base portion of the light-transmissive member, and
cutting the light-reflective member between the projecting portions.

3. The method for manufacturing a light-emitting device according to claim 2 , wherein, in the step of removing the base portion of the light-transmissive member, part of the projecting portions of the light-transmissive member and part of the light-reflective member are also removed.

4. The method for manufacturing a light-emitting device according to claim 1 ,
wherein the light-transmissive member comprises a plurality of projecting portions connected to each other via the base portion;
wherein the step of providing a light-emitting element comprises providing a plurality of light-emitting elements, each having a main emitting surface and an electrode formation surface opposite to the main emitting surface; and
wherein each light-emitting element is disposed on a respective one of the projecting portions.

5. The method for manufacturing a light-emitting device according to claim 1 ,
wherein the step of providing the light-transmissive member comprises
forming the projecting portion by forming at least one groove in the phosphor-containing portion and partially in the phosphor-free portion.

6. The method for manufacturing a light-emitting device according to claim 5 , further comprising removing the base portion of the light-transmissive member, which removes part of the phosphor-free portion.

7. The method for manufacturing a light-emitting device according to claim 1 , wherein, in the step of disposing the light-emitting element on the light-transmissive member, the light-emitting element is disposed on the light-transmissive member with a light-transmissive adhesive disposed therebetween.

8. The method for manufacturing a light-emitting device according to claim 7 ,
wherein the light-transmissive member comprises a plurality of projecting portions connected to each other via the base portion;
wherein the step of providing a light-emitting element comprises providing a plurality of light-emitting elements, each having a main emitting surface and an electrode formation surface opposite to the main emitting surface;
wherein each light-emitting element is disposed on a respective one of the projecting portions; and
wherein the light-transmissive adhesive connects at least a part of lateral surfaces of adjacent ones of the light-emitting elements.

Assignees

• Nichia Corp

Inventors

• Hayashi Tadao

Classifications

• H01L33/0075

  Electricity · mapped topic

• H01L33/387

  Electricity · mapped topic

• H01L33/508

  Electricity · mapped topic

• H01L2933/0058

  Electricity · mapped topic

• H01L33/32

  Electricity · mapped topic