Light emitting component

Patent metadata

Field	Value
Publication number	US-2016240741-A1
Application number	US-201615045265-A
Country	US
Kind code	A1
Filing date	Feb 17, 2016
Priority date	Feb 17, 2015
Publication date	Aug 18, 2016
Grant date	—

Abstract

A light emitting component includes an epitaxial structure, a first electrode, a conducting layer and a second electrode. The epitaxial structure includes a substrate, a first semiconductor layer, a light emitting layer and a second semiconductor layer. The first electrode is disposed on the first semiconductor layer. The conducting layer is disposed on the second semiconductor layer and includes a first conducting area and a second conducting area, wherein a resistance of the first conducting area is smaller than a resistance of the second conducting area. The second electrode is disposed on the conducting layer and has an extension portion, wherein the extension portion extends toward the first electrode and the first conducting area overlaps at least a part of the extension portion.

First claim

What is claimed is:

1 . A light emitting component comprising:
an epitaxial structure comprising a substrate, a first semiconductor layer, a light emitting layer and a second semiconductor layer; a first electrode disposed on the first semiconductor layer; a conducting layer, disposed on the second semiconductor layer, comprising a first conducting area and a second conducting area, a resistance of the first conducting area being smaller than a resistance of the second conducting area; and a second electrode, disposed on the conducting layer, having an extension portion toward the first electrode, the first conducting area overlapping at least a part of the extension portion.

2 . The light emitting component of claim 1 , wherein a thickness of the first conducting area is larger a thickness of the second conducting area.

3 . The light emitting component of claim 1 , wherein the conducting layer comprises a first sub-conducting layer and a second sub-conducting layer, a projection area of the first sub-conducting layer on the substrate is smaller than a projection area of the second sub-conducting layer on the substrate, and an overlapped area of the first sub-conducting layer and the second sub-conducting layer forms the first conducting area, and a remaining area of the second sub-conducting layer not overlapped with the first sub-conducting layer forms the second conducting area.

4 . The light emitting component of claim 3 , wherein the second sub-conducting layer is disposed on the second semiconductor layer, and the first sub-conducting layer is disposed on the second sub-conducting layer.

5 . The light emitting component of claim 3 , wherein the first sub-conducting layer is disposed on the second semiconductor layer, and the second sub-conducting layer is disposed on the first sub-conducting layer and the second semiconductor layer.

6 . The light emitting component of claim 1 , wherein a dopant concentration of the first conducting area is larger than a dopant concentration of the second conducting area.

7 . The light emitting component of claim 6 , wherein a material of the conducting layer comprises indium tin oxide.

8 . The light emitting component of claim 1 , wherein a length of the first conducting area in a direction parallel to the extension portion is larger than or equal to a half of a total length of the second electrode in the direction parallel to the extension portion.

9 . The light emitting component of claim 1 , wherein an edge of the first conducting area is located between a center of the extension portion and the first electrode.

10 . The light emitting component of claim 1 , further comprising a current block layer disposed between the conducting layer and the epitaxial structure.

Assignees

• Genesis Photonics Inc

Inventors

• Kuo Yu-Chen
• Lan yan-ting
• Huang Jing-En
• Lai Teng-Hsien
• Kang Kai-Shun

Classifications

• H10W90/756

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• H10W72/07554

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• H10W72/884

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• H10W72/547

  Dispositions of multiple bond wires · CPC title

• H10W90/00 Primary

  Package configurations · CPC title