Light emitting device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2016240751-A1
Application number	US-201615045471-A
Country	US
Kind code	A1
Filing date	Feb 17, 2016
Priority date	Feb 17, 2015
Publication date	Aug 18, 2016
Grant date	—

Abstract

A light-emitting device including a light-emitting unit, a packaging sealant, a transparent layer, and a reflective structure is provided. The light-emitting unit has at least one epitaxial layer and two electrodes correspondingly formed on the epitaxial layer. The epitaxial layer has a top surface, a bottom surface on which the two electrodes are exposed, and a side surface connecting the bottom surface and the top surface. The packaging sealant is formed on the top surface and the side surface of the epitaxial layer. The transparent layer is disposed on the packaging sealant and located above the top surface of the epitaxial layer. The reflective structure is disposed surrounding the side surface of the epitaxial layer and formed on the packaging sealant. A manufacturing method of the above light-emitting device is further provided.

First claim

What is claimed is:

1 . A light-emitting device, comprising:
a light-emitting unit having at least one epitaxial layer and two electrodes correspondingly formed on the epitaxial layer, wherein the epitaxial layer has a top surface, a bottom surface on which the two electrodes are exposed, and a side surface connecting the bottom surface and the top surface; a packaging sealant at least formed on the top surface of the epitaxial layer; a transparent layer disposed on the packaging sealant and the top surface of the epitaxial layer; and a reflective structure disposed surrounding the side surface of the epitaxial layer and formed on the packaging sealant.

2 . The light-emitting device according to claim 1 , wherein the packaging sealant is further formed on the side surface of the epitaxial layer, and the reflective structure is formed on a surface of the packaging sealant and surrounds the epitaxial layers and extends to the peripheral of the transparent layer.

3 . The light-emitting device according to claim 2 , wherein the packaging sealant has a top surface and a bottom surface, the transparent layer is formed on the top surface of the packaging sealant, and the reflective structure is further formed on the bottom surface of the packaging sealant.

4 . The light-emitting device according to claim 1 , wherein the reflective structure is formed of a binder and a plurality of reflective particles dispersed in the binder.

5 . The light-emitting device according to claim 4 , wherein the reflective particles are formed of a material selected from a group composed of titanium dioxide, zirconium dioxide, barium sulfate, and tantalum pentoxide.

6 . The light-emitting device according to claim 4 , wherein the binder is formed of a material selected from polymer resin, acrylic resin or silicone.

7 . The light-emitting device according to claim 1 , wherein the reflective structure is formed of a material selected from silver, aluminum, platinum, gold, or an alloy thereof.

8 . The light-emitting device according to claim 1 , wherein the reflective structure is a Bragg reflector.

9 . The light-emitting device according to claim 1 , wherein the packaging sealant contains phosphor powder.

10 . A manufacturing method of light-emitting device, comprising:
disposing at least one light-emitting device on a substrate, wherein the light-emitting device has an epitaxial structure and two electrodes; forming a packaging sealant on the substrate, wherein the packaging sealant covers the epitaxial structure and exposes the two electrodes; forming a transparent layer on the packaging sealant; and forming a reflective structure at least on a surface of the packaging sealant.

11 . The manufacturing method of light-emitting device according to claim 10 , wherein the packaging sealant comprises a phosphor powder.

12 . The manufacturing method of light-emitting device according to claim 10 , wherein in the step of disposing at least one light-emitting device on the substrate, a plurality of light-emitting devices are disposed at intervals on the substrate, and in the step of forming the reflective structure, the reflective structure is obtained by solidifying a liquid reflective resin interposed to the intervals.

13 . The manufacturing method of light-emitting device according to claim 12 , wherein the liquid reflective resin comprises a binder and a plurality of reflective particles dispersed in the binder.

14 . The manufacturing method of light-emitting device according to claim 10 , wherein in the step of forming the reflective structure, the reflective structure is formed by way of vapor deposition or sputtering.

15 . The manufacturing method of light-emitting device according to claim 12 , further comprising a step of cutting along the intervals to obtain the light-emitting device with the reflective structure.

Assignees

• Genesis Photonics Inc

Inventors

• Ting Shao-Ying
• Huang Kuan-Chieh
• Huang Jing-En
• Huang Yi-Ru

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/547

  Dispositions of multiple bond wires · CPC title

• H10W90/00 Primary

  Package configurations · CPC title