Plate-shaped body for temperature measurement and temperature measuring apparatus provided with the same

Patent metadata

Field	Value
Publication number	US-10502639-B2
Application number	US-201214239352-A
Country	US
Kind code	B2
Filing date	Aug 22, 2012
Priority date	Aug 26, 2011
Publication date	Dec 10, 2019
Grant date	Dec 10, 2019

Abstract

A plate-shaped body for temperature measurement which, simply by being mounted on a mounting surface of an electrostatic chuck apparatus and without using a semiconductor wafer itself, is able to easily optimize the in-plane temperature distribution of the mounting surface of the electrostatic chuck apparatus, the temperature rising characteristics, and the cooling characteristics during decreases in temperature. In such plate-shaped body for temperature measurement (1), an insulating adhesive (3) is bonded to the entirety of a surface (2a) of a wafer (2), a heater element (4) is provided on the insulating adhesive (3), a temperature measurement region (5) is provided used to measure the temperature of the surface (2a) of the wafer (2) in a region excluding the heater element (4) on the surface (3a) of the insulating adhesive (3), and the heater element (4) and the temperature measurement region (5) are coated with an insulating film (6).

First claim

The invention claimed is:

1. A temperature measurement plate, comprising:
a wafer having an insulating adhesive on one main surface of the wafer;
a heating member on the insulating adhesive;
a plurality of temperature measurement regions provided on the insulating adhesive; and
an insulating film covering the heating member and the plurality of temperature measurement regions,
wherein the insulating adhesive includes any one type of an acrylic-based adhesive, and epoxy-based adhesive, and a polyimide amide-based adhesive,
the insulating film is formed of polytetrafluoroethylene, polyimide, or polyamide, and
the plurality of temperature measurement regions are arrayed in one row at predetermined intervals from each other and are connected with each other.

2. The temperature measurement plate according to claim 1 , wherein the heating member is a metal foil.

3. The temperature measurement plate according to claim 1 or 2 , wherein the wafer is formed of any one type of silicon, silicon carbide, silicon nitride, III-V group compound semiconductors, and II-VI group compound semiconductors.

4. The temperature measurement plate according to claim 2 , wherein the metal foil is formed of titanium, tantalum, or molybdenum.

5. The temperature measurement plate according to claim 1 , wherein the insulating adhesive is bonded to an entire surface of the wafer, and the heating member has a meandering shape.

6. The temperature measurement plate according to claim 5 , wherein the plurality of the temperature measurement regions are connected with each other in one row between meandering portions of the meandering shape.

7. The temperature measurement plate according to claim 1 , further comprising voltage application electrodes provided at opposite ends of the heating member.

8. The temperature measurement plate according to claim 1 , wherein the plurality of temperature measurement regions are arrayed in a cross shape.

9. The temperature measurement plate according to claim 8 , wherein the cross shape intersects at a center portion of the wafer.

10. The temperature measurement plate according to claim 1 , wherein the insulating film has an infrared transmittance of 80% or less.

11. The temperature measurement plate according to claim 1 , wherein each of the plurality of temperature measurement regions is a region with a circular shape having a diameter of 2 mm to 15 mm.

12. A temperature measuring apparatus comprising:
a temperature measurement plate comprising: a wafer having an insulating adhesive on one main surface of the wafer; a heating member on the insulating adhesive; a plurality of temperature measurement regions provided on the insulating adhesive; and an insulating film covering the heating member and the plurality of temperature measurement regions;
an electrostatic chuck apparatus comprising: an electrostatic chuck section having a mounting surface; and a cooling base section;
a thermograph; and
a sealed container compromising a ceiling plate having a window,
wherein the insulating adhesive includes any one type of an acrylic-based adhesive, an epoxy-based adhesive, and a polyimide amide-based adhesive,
the insulating film is formed of polytetrafluoroethylene, polyimide, or polyamide,
the wafer is configured to be mountable on the mounting surface such that the temperature measurement regions face the thermograph via the insulating film and to be removable from the mounting surface,
the electrostatic chuck apparatus is stored in a bottom section of the sealed container,
the thermograph is provided outside the ceiling plate and faces the electrostatic chuck apparatus via the window, and
the plurality of temperature measurement regions are arrayed in one row at predetermined intervals from each other and are connected with each other.

Assignees

• Kosakai Mamoru
• Ishimura Kazunori
• Watanabe Takeshi
• Kouno Hitoshi
• Hayahara Ryuuji
• Sumitomo Osaka Cement Co Ltd

Inventors

• Kosakai Mamoru
• Ishimura Kazunori
• Watanabe Takeshi
• Kouno Hitoshi
• Hayahara Ryuuji

Classifications

• H10P72/722

  Details of electrostatic chucks · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/0602 Primary

  Temperature monitoring · CPC title

• H05B2203/002

  Heaters using a particular layout for the resistive material or resistive elements · CPC title

• H05B1/0233

  for semiconductors manufacturing · CPC title