Electrostatic chuck device

Patent metadata

Field	Value
Publication number	US-9330953-B2
Application number	US-201214005880-A
Country	US
Kind code	B2
Filing date	Mar 23, 2012
Priority date	Mar 23, 2011
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

An electrostatic chuck device ( 1 ) according to the invention includes an electrostatic chuck section ( 2 ) that has a principal surface as a placement surface on which a plate-shaped sample is placed, and is made to have an internal electrode for electrostatic adsorption built-in, and a cooling plate section ( 3 ) that cools the electrostatic chuck section ( 2 ), wherein a heating member ( 5 ) is bonded to a principal surface on the opposite side to the placement surface of the electrostatic chuck section ( 2 ) through a first adhesive material layer ( 4 ), and the electrostatic chuck section ( 2 ) and the heating member ( 5 ) are bonded to and integrated with the cooling plate section ( 3 ) through an acrylic adhesive layer ( 9 ) having flexibility and insulation properties.

First claim

The invention claimed is:

1. An electrostatic chuck device comprising:
an electrostatic chuck section that has a principal surface as a placement surface on which a plate-shaped sample is placed, and is made to have an internal electrode for electrostatic adsorption built-in; and
a cooling plate section that cools the electrostatic chuck section,
wherein a heating member is bonded to a principal surface on the opposite side to the placement surface of the electrostatic chuck section through a first adhesive material layer,
the electrostatic chuck section and the heating member are bonded to and integrated with the cooling plate section through an acrylic adhesive layer having flexibility and insulation properties, and
a thickness of the acrylic adhesive layer is set to be 250 μm or less, a Young's modulus of a spacer that is provided between the heating member and the cooling plate section is set to be in a range of 5 MPa or more and 5 GPa or less, and a difference in thermal expansion between the spacer and the acrylic adhesive layer is set to be ±200% or less.

2. The electrostatic chuck device according to claim 1 , wherein the acrylic adhesive layer is made to contain vinyl acetate or vinyl butyrate in a range of 1% by volume or more and 50% by volume or less.

3. The electrostatic chuck device according to claim 1 , wherein a Shore hardness of the acrylic adhesive layer is D40 or less.

4. The electrostatic chuck device according to claim 1 , wherein a terminal for applying voltage that applies voltage to the internal electrode for electrostatic adsorption is connected to the internal electrode for electrostatic adsorption, an insulator is provided so as to surround the terminal for applying voltage, and a thickness of the acrylic adhesive layer between the insulator and the electrostatic chuck section is set to be in a range of 50 μm or more and 150μm or less.

5. The electrostatic chuck device according to any one of claims 1 and 2 - 4 , wherein an insulating material layer is provided on a principal surface on the electrostatic chuck section side of the cooling plate section with a second adhesive material layer interposed therebetween, and
the insulating material layer is bonded to and integrated with the electrostatic chuck section and the heating member through the acrylic adhesive layer.

Assignees

• Miura Yukio
• Maeta Shinichi
• Satou Takashi
• Furuuchi Kei
• Sumitomo Osaka Cement Co Ltd

Inventors

• Miura Yukio
• Maeta Shinichi
• Satou Takashi
• Furuuchi Kei

Classifications

• H10P72/0434

  mainly by convection · CPC title

• H10P72/72 Primary

  using electrostatic chucks · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H10P72/70 Primary

  for supporting or gripping · CPC title

• H01L21/6831

  Electricity · mapped topic