Peeling method, display device, module, and electronic device

Patent metadata

Field	Value
Publication number	US-10475820-B2
Application number	US-201816143970-A
Country	US
Kind code	B2
Filing date	Sep 27, 2018
Priority date	May 18, 2016
Publication date	Nov 12, 2019
Grant date	Nov 12, 2019

Abstract

To provide a peeling method that achieves low cost and high mass productivity. The peeling method includes the steps of: forming a first layer with a photosensitive material over a formation substrate; forming a first region and a second region having a smaller thickness than the first region in the first layer by photolithography to form a resin layer having the first region and the second region; forming a transistor including an oxide semiconductor in a channel formation region over the first region in the resin layer; forming a conductive layer over the second region in the resin layer; and irradiating the resin layer with laser light to separate the transistor and the formation substrate.

First claim

What is claimed is:

1. A display device comprising:
a resin layer comprising an opening;
an insulating layer over the resin layer and comprising an opening;
a transistor comprising an oxide semiconductor in a channel formation region over the insulating layer;
a conductive layer over the insulating layer; and
a display element electrically connected to the transistor,
wherein the conductive layer overlaps with the opening of the insulating layer and the opening of the resin layer, and
wherein at least part of the conductive layer is exposed in the opening of the resin layer.

2. The display device according to claim 1 , wherein the resin layer comprises polyimide.

3. The display device according to claim 1 , wherein a thickness of the resin layer is greater than or equal to 0.1 μm and less than or equal to 3 μm.

4. The display device according to claim 1 , wherein the conductive layer comprises an oxide conductive layer.

5. The display device according to claim 1 , wherein the oxide semiconductor of the transistor and the conductive layer comprise the same metal element.

6. The display device according to claim 1 , wherein an exposed surface of the resin layer is positioned on an inner side than an exposed surface of the conductive layer.

7. A module comprising:
the display device according to claim 1 ; and
a circuit board,
wherein the circuit board is electrically connected to the conductive layer through the opening of the resin layer.

8. An electronic device comprising:
the module according to claim 7 ; and
at least one of an antenna, a battery, a housing, a camera, a speaker, a microphone, and an operation button.

9. The display device according to claim 1 , wherein an exposed surface of the resin layer is positioned on an outer side than an exposed surface of the conductive layer.

10. A display device comprising:
a resin layer comprising an opening;
an insulating layer over the resin layer and comprising an opening;
a transistor comprising an oxide semiconductor in a channel formation region over the insulating layer;
a conductive layer over the insulating layer; and
a display element electrically connected to the transistor,
wherein the insulating layer covers a periphery of the opening of the resin layer,
wherein the conductive layer overlaps with the opening of the insulating layer and the opening of the resin layer, and
wherein at least part of the conductive layer is exposed in the opening of the resin layer.

11. The display device according to claim 10 , wherein the resin layer comprises polyimide.

12. The display device according to claim 10 , wherein a thickness of the resin layer is greater than or equal to 0.1 μm and less than or equal to 3 μm.

13. The display device according to claim 10 , wherein the conductive layer comprises an oxide conductive layer.

14. The display device according to claim 10 , wherein the oxide semiconductor of the transistor and the conductive layer comprise the same metal element.

15. The display device according to claim 10 , wherein an exposed surface of the resin layer is positioned on an inner side than an exposed surface of the conductive layer.

16. The display device according to claim 10 , wherein an exposed surface of the resin layer is positioned on an outer side than an exposed surface of the conductive layer.

17. A module comprising:
the display device according to claim 10 ; and
a circuit board,
wherein the circuit board is electrically connected to the conductive layer through the opening of the resin layer.

18. An electronic device comprising:
the module according to claim 17 ; and
at least one of an antenna, a battery, a housing, a camera, a speaker, a microphone, and an operation button.

19. A display module comprising:
a circuit board;
a resin layer comprising an opening;
an insulating layer over the resin layer and comprising an opening;
a transistor comprising an oxide semiconductor in a channel formation region over the insulating layer;
a conductive layer over the insulating layer; and
a display element electrically connected to the transistor,
wherein the conductive layer overlaps with the opening of the insulating layer and the opening of the resin layer,
wherein the circuit board overlaps with the conductive layer and the opening of the resin layer, and
wherein the circuit board is electrically connected to the conductive layer through the opening of the resin layer.

20. The display module according to claim 19 , wherein the resin layer comprises polyimide.

21. The display module according to claim 19 , wherein a thickness of the resin layer is greater than or equal to 0.1 μm and less than or equal to 3 μm.

22. The display module according to claim 19 , wherein the conductive layer comprises an oxide conductive layer.

23. The display module according to claim 19 , wherein the oxide semiconductor of the transistor and the conductive layer comprise the same metal element.

24. The display device according to claim 19 , wherein a surface of the circuit board side of the resin layer is positioned on an inner side than a surface of the circuit board side of the conductive layer.

25. The display device according to claim 19 , wherein a surface of the circuit board side of the resin layer is positioned on an outer side than a surface of the circuit board side of the conductive layer.

Assignees

• Semiconductor Energy Lab

Inventors

• Yanaka Junpei
• Kumakura Kayo
• Sato Masataka
• Idojiri Satoru
• Yoshizumi Kensuke
• Tateishi Mari
• Takase Natsuko

Classifications

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H01L27/124

  Electricity · mapped topic

• H01L27/3262

  Electricity · mapped topic

• H01L51/003

  Electricity · mapped topic

• H01L2227/323

  Electricity · mapped topic