Display device and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9559316-B2
Application number	US-201615145246-A
Country	US
Kind code	B2
Filing date	May 3, 2016
Priority date	Dec 2, 2013
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

First claim

What is claimed is:

1. A method for manufacturing a display device, the method comprising the steps of:
forming a first organic resin layer over a first substrate;
forming a first insulating film over the first organic resin layer;
forming a transistor comprising a channel formation region over the first insulating film, the channel formation region comprising an oxide semiconductor material;
forming a second insulating film over the transistor;
forming a light emitting element over the second insulating film, the light emitting element being electrically connected to the transistor;
disposing a second substrate over the light emitting element, the second substrate being provided with a second organic resin layer so that the second organic resin layer is disposed between the light emitting element and the second substrate;
irradiating the first organic resin layer with a first laser through the first substrate;
separating the first substrate from the first organic resin layer after the irradiation with the first laser;
bonding a first flexible substrate and the first organic resin layer after separating the first substrate from the first organic resin layer;
irradiating the second organic resin layer with a second laser through the second substrate;
separating the second substrate from the second organic resin layer after the irradiation with the second laser; and
bonding a second flexible substrate and the second organic resin layer after separating the second substrate from the second organic resin layer.

2. The method for manufacturing a display device according to claim 1 ,
wherein each of the first organic resin layer and the second organic resin layer comprises at least one of an epoxy resin, an acrylic resin, a polyimide resin, a polyimide resin, and a polyamide-imide resin.

3. The method for manufacturing a display device according to claim 1 ,
wherein each of the first organic resin layer and the second organic resin layer is formed by using any one of a spin coating method, a dip coating method, and a doctor blade method.

4. The method for manufacturing a display device according to claim 1 ,
wherein each of the first laser and the second laser is emitted from an excimer laser device.

5. The method for manufacturing a display device according to claim 1 ,
wherein the first substrate is moved in one direction while irradiating the first organic resin layer with the first laser.

6. The method for manufacturing a display device according to claim 1 ,
wherein the oxide semiconductor material comprises indium and zinc.

7. The method for manufacturing a display device according to claim 1 ,
wherein the channel formation region comprises a crystalline region.

8. The method for manufacturing a display device according to claim 1 ,
wherein the step of bonding the first flexible substrate and the first organic resin layer is performed by using a bonding layer, and
wherein the bonding layer comprises any one of an epoxy resin, an acrylic resin, a silicone resin, and a phenol resin.

9. The method for manufacturing a display device according to claim 1 ,
wherein the light emitting element is an organic EL element.

10. A method for manufacturing a display device, the method comprising the steps of:
forming a first organic resin layer over a first substrate;
forming a first insulating film over the first organic resin layer;
forming a transistor comprising a channel formation region over the first insulating film, the channel formation region comprising an oxide semiconductor material;
forming a second insulating film over the transistor;
forming a light emitting element over the second insulating film, the light emitting element being electrically connected to the transistor;
disposing a second substrate over the light emitting element, the second substrate being provided with a second organic resin layer so that the second organic resin layer is disposed between the light emitting element and the second substrate;
irradiating the first organic resin layer with a first ultraviolet light through the first substrate;
separating the first substrate from the first organic resin layer after the irradiation with the first ultraviolet light;
bonding a first flexible substrate and the first organic resin layer after separating the first substrate from the first organic resin layer;
irradiating the second organic resin layer with a second ultraviolet light through the second substrate;
separating the second substrate from the second organic resin layer after the irradiation with the second ultraviolet light; and
bonding a second flexible substrate and the second organic resin layer after separating the second substrate from the second organic resin layer,
wherein each of the first organic resin layer and the second organic resin layer comprises at least one of an epoxy resin, an acrylic resin, a polyimide resin, a polyamide resin, and a polyamide-imide resin, and
wherein a thickness of each of the first organic resin layer and the second organic resin layer is less than or equal to 20 μm.

11. The method for manufacturing a display device according to claim 10 ,
wherein each of the first organic resin layer and the second organic resin layer is formed by using any one of a spin coating method, a dip coating method, and a doctor blade method.

12. The method for manufacturing a display device according to claim 10 ,
wherein each of the first ultraviolet light and the second ultraviolet light is emitted from an excimer laser device.

13. The method for manufacturing a display device according to claim 10 ,
wherein the first substrate is moved in one direction while irradiating the first organic resin layer with the first ultraviolet light.

14. The method for manufacturing a display device according to claim 10 ,
wherein the oxide semiconductor material comprises indium and zinc.

15. The method for manufacturing a display device according to claim 10 ,
wherein the channel formation region comprises a crystalline region.

16. The method for manufacturing a display device according to claim 10 ,
wherein the step of bonding the first flexible substrate and the first organic resin layer is performed by using a bonding layer, and
wherein the bonding layer comprises any one of an epoxy resin, an acrylic resin, a silicone resin, and a phenol resin.

17. The method for manufacturing a display device according to claim 10 ,
wherein the light emitting element is an organic EL element.

18. A method for manufacturing a display device, the method comprising the steps of:
forming an organic resin layer over a substrate;
forming an insulating film over the organic resin layer;
forming a transistor comprising a channel formation region over the insulating film, the channel formation region comprising an oxide semiconductor layer over the insulating film; and
reducing adhesion between the organic resin layer and the substrate by irradiating the organic resin layer with a linear beam through the substrate,
wherein a thickness of the organic resin layer is less than or equal to 20 μm.

19. The method for manufacturing a display device according to claim 18 ,
wherein the substrate is separated from the organic resin layer by reducing adhesion between the organic resin layer and the substrate.

20. The method for manufacturing a display device according to claim 18 ,
wherein the organic resin layer comprises at least one of an epoxy resin, an acrylic resin, a polyimide res

Assignees

• Semiconductor Energy Lab

Inventors

• Yamazaki Shunpei
• Ohno Masakatsu
• Adachi Hiroki
• Idojiri Satoru
• Takeshima Koichi

Classifications

• B23K26/0617

  and with spots spaced along the common axis · CPC title

• B23K26/0648

  comprising lenses · CPC title

• G09F9/33

  being semiconductor devices, e.g. diodes · CPC title

• B23K26/0622

  by shaping pulses · CPC title

• B23K26/083

  Devices involving movement of the workpiece in at least one axial direction · CPC title