Transistor, semiconductor device, and semiconductor structure
US-2024379874-A1 · Nov 14, 2024 · US
US8980685B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8980685-B2 |
| Application number | US-201414191853-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 27, 2014 |
| Priority date | Oct 24, 2008 |
| Publication date | Mar 17, 2015 |
| Grant date | Mar 17, 2015 |
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An object is to manufacture a semiconductor device including an oxide semiconductor at low cost with high productivity in such a manner that a photolithography process is simplified by reducing the number of light-exposure masks In a method for manufacturing a semiconductor device including a channel-etched inverted-staggered thin film transistor, an oxide semiconductor film and a conductive film are etched using a mask layer formed with the use of a multi-tone mask which is a light-exposure mask through which light is transmitted so as to have a plurality of intensities. In etching steps, a first etching step is performed by wet etching in which an etchant is used, and a second etching step is performed by dry etching in which an etching gas is used.
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing a semiconductor device, comprising: forming a gate electrode layer over an insulating surface, wherein the gate electrode layer comprises a stack of a first layer comprising Ti and a second layer comprising Cu; forming a gate insulating layer over the gate electrode layer, wherein the gate insulating layer comprises a stack of a silicon nitride layer and a first silicon oxide layer, and the silicon nitride layer covers the second…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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