Electronic component and method for manufacturing same
US-2025391593-A1 · Dec 25, 2025 · US
the housing or enclosure being formed as coating or mould without outer sheath (H01C1/032 takes precedence)
the housing or enclosure being formed as coating or mould without outer sheath (H01C1/032 takes precedence) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01C1/034 |
| Official title | the housing or enclosure being formed as coating or mould without outer sheath (H01C1/032 takes precedence) |
| Display label | the housing or enclosure being formed as coating or mould without outer sheath (H01C1/032 takes precedence) |
| Total patents | 66 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 4 |
| 2017 | 3 |
| 2018 | 8 |
| 2019 | 12 |
| 2020 | 6 |
| 2021 | 5 |
| 2022 | 5 |
| 2023 | 6 |
| 2024 | 5 |
| 2025 | 9 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Resistor
US-12476029-B2 · Nov 18, 2025 · US
Electronic component and film forming method
US-2025149209-A1 · May 8, 2025 · US
Electronic component
US-2025095885-A1 · Mar 20, 2025 · US
Electronic component
US-12183488-B2 · Dec 31, 2024 · US
Radiation curable thermistor encapsulation
US-12125617-B2 · Oct 22, 2024 · US
Semiconductor device and method for manufacturing same
US-2024339490-A1 · Oct 10, 2024 · US
Electronic component
US-2024321487-A1 · Sep 26, 2024 · US
Electronic component and film forming method
US-2024221981-A1 · Jul 4, 2024 · US
Chip resistor
US-11769612-B2 · Sep 26, 2023 · US
Radiation curable thermistor encapsulation
US-2023274865-A1 · Aug 31, 2023 · US
Resistor
US-2023268104-A1 · Aug 24, 2023 · US
Radiation curable thermistor encapsulation
US-11682505-B2 · Jun 20, 2023 · US
Electronic component
US-2023058805-A1 · Feb 23, 2023 · US
Resistor and manufacturing method of resistor
US-2023040165-A1 · Feb 9, 2023 · US
Thermistor die-based thermal probe
US-11525739-B2 · Dec 13, 2022 · US
Sulfurization detection resistor
US-11506594-B2 · Nov 22, 2022 · US
Chip resistor
US-2022130578-A1 · Apr 28, 2022 · US
Component substrate having a protective function
US-11239010-B2 · Feb 1, 2022 · US
Surface-modified glass, electronic component, and method for forming silicate film
US-2022024814-A1 · Jan 27, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01C1/034?
- CPC H01C1/034 is the Cooperative Patent Classification code for “the housing or enclosure being formed as coating or mould without outer sheath (H01C1/032 takes precedence).”
- How many patents are filed under CPC H01C1/034 (the housing or enclosure being formed as coating or mould without outer sheath (H01C1/032 takes precedence))?
- Our database includes 66 publications tagged with this CPC code.
- Is patent activity under CPC H01C1/034 growing?
- Publication counts under this code: 5 in 2024 vs 9 in 2025 (latest complete years).