Chip resistor

US2016343479A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016343479-A1
Application numberUS-201515107079-A
CountryUS
Kind codeA1
Filing dateFeb 2, 2015
Priority dateFeb 27, 2014
Publication dateNov 24, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A chip resistor includes a resistive element, a pair of electrodes, and heat radiator plates. The resistive element is made of a plate-shaped metal. The pair of electrodes is formed on both ends of a first surface of the resistive element. The heat radiator plates are fastened to a second surface of the resistive element and are disposed spaced apart from each other via a gap therebetween.

First claim

Opening claim text (preview).

1 . A chip resistor comprising: a resistive element of a plate-shaped metal; first and second electrodes formed at both ends of a first surface of the resistive element; and a plurality of heat radiator plates fastened to a second surface of the resistive element, wherein the plurality of heat radiator plates includes a first heat radiator plate closest to the first electrode and a second heat radiator plate closest to the second electrode and are disposed spaced apart from each other via a gap therebetween. 2 . The chip resistor according to claim 1 , wherein the second heat radiator plate has a heat conductivity different from a heat conductivity of the first heat radiator plate. 3 . The chip resistor according to claim 1 , further comprising an upper-layer heat radiator plate laminated on the first heat radiator plate and the second heat radiator plate. 4 . The chip resistor according to claim 1 , further comprising: a first upper-layer heat radiator plate laminated on the first heat radiator plate; and a second upper-layer heat radiator plate laminated on the second heat radiator plate and thermally coupled with the first upper-layer heat radiator plate. 5 . The chip resistor according to claim 1 , wherein the first electrode is thermally coupled with the first heat radiator plate, and wherein the second electrode is thermally coupled with the second heat radiator plate. 6 . The chip resistor according to claim 1 , wherein a gap between the first heat radiator plate and the second heat radiator plate is away from a center line of the resistive element. 7 . The chip resistor according to claim 1 , wherein each of the plurality of heat radiator plates has a roughened surface. 8 . The chip resistor according to claim 1 , wherein each of the plurality of heat radiator plates includes a ceramic plate having a first surface stuck onto the second surface of the resistive element and a second surface opposite to the first surface; and a metal layer provided on the second surface of the ceramic plate. 9 . A chip resistor comprising: a resistive element of a plate-shaped metal and provided with a trimming groove; a pair of electrodes formed at both ends of a first surface of the resistive element; and a heat radiator plate fastened to a second surface of the resistive element and covering at least a part provided with the trimming groove, wherein an end of the heat radiator plate substantially agrees with an outer perimeter of the part provided with the trimming groove in a planar view.

Assignees

Inventors

Classifications

  • including means to minimise changes in resistance with changes in temperature · CPC title

  • Thick film resistors · CPC title

  • the resistive element being embedded in insulation with outer enclosing sheath · CPC title

  • Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts (resistors in general H01C; microwave or radiowave terminations H01P1/26; coupling devices H01R) · CPC title

  • Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title

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What does patent US2016343479A1 cover?
A chip resistor includes a resistive element, a pair of electrodes, and heat radiator plates. The resistive element is made of a plate-shaped metal. The pair of electrodes is formed on both ends of a first surface of the resistive element. The heat radiator plates are fastened to a second surface of the resistive element and are disposed spaced apart from each other via a gap therebetween.
Who is the assignee on this patent?
Panasonic Ip Man Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01C1/084. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Nov 24 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).