Remote detection of plating on wafer holding apparatus

Patent metadata

Field	Value
Publication number	US-10416092-B2
Application number	US-201715638131-A
Country	US
Kind code	B2
Filing date	Jun 29, 2017
Priority date	Feb 15, 2013
Publication date	Sep 17, 2019
Grant date	Sep 17, 2019

Abstract

Methods and apparatus for detecting the presence or absence of unwanted metal deposits on a substrate holder of an electroplating apparatus are described herein. In various embodiments, a plating sensor is used to detect unwanted metal deposits. The plating sensor may be mounted relatively far away from the area that it measures (e.g., the sensor target area). For instance, the plating sensor may be on one side of the electroplating apparatus (in some cases mounted on a drip shield), and the sensor target area may be on the opposite side of the electroplating apparatus. In this way, the plating sensor can measure across the electroplating apparatus. This placement provides a relatively deep depth of focus for the plating sensor, and provides some physical separation between the plating sensor and the electroplating chemistry. Both of these factors lead to more reliable detection results.

First claim

What is claimed is:

1. An electroplating apparatus comprising:
an electrolyte vessel configured to hold electrolyte during electroplating;
a substrate holder configured to support a substrate during electroplating, wherein the substrate holder is annularly shaped and supports the substrate at its periphery, the substrate holder comprising a sensor target area;
a plating sensor comprising a light source aimed at the sensor target area, wherein the plating sensor distinguishes between (i) areas on the sensor target area where unwanted metal deposits are present and (ii) areas on the sensor target area where unwanted metal deposits are absent;
an alignment fixture that fits over the substrate holder, the alignment fixture comprising a first portion and a second portion, wherein the first and second portions are distinguishable from one another with respect to a property measured by the plating sensor.

2. The electroplating apparatus of claim 1 , wherein the substrate holder comprises a cup and a lip seal, the cup comprising a bottom surface and an inner wall, wherein the lip seal is positioned at the top of the inner wall of the cup.

3. The electroplating apparatus of claim 2 , wherein the sensor target area is on the lip seal.

4. The electroplating apparatus of claim 2 , wherein the sensor target area is on the inner wall of the cup.

5. The electroplating apparatus of claim 4 , wherein the sensor target area is on both the inner wall of the cup and the lip seal.

6. The electroplating apparatus of claim 1 , further comprising a drip shield, wherein the plating sensor is positioned on the drip shield.

7. The electroplating apparatus of claim 6 , wherein the drip shield comprises a wall and a central opening through which the substrate holder fits.

8. The electroplating apparatus of claim 1 , wherein the plating sensor is a color-based sensor, an intensity-based sensor, or a camera.

9. The electroplating apparatus of claim 1 , wherein the substrate holder comprises a cup and a lip seal, the cup comprising a bottom surface and an inner wall, wherein the lip seal is positioned at the top of the inner wall of the cup, wherein the first portion of the alignment fixture is proximate the lip seal such that the plating sensor detects the presence or absence of metal deposits on the lip seal.

10. The electroplating apparatus of claim 1 , wherein the substrate holder comprises a cup and a lip seal, the cup comprising a bottom surface and an inner wall, wherein the lip seal is positioned at the top of the inner wall of the cup, wherein the first portion of the alignment fixture is proximate the inner wall of the cup such that the plating sensor detects the presence or absence of metal deposits on the inner wall of the cup.

11. The electroplating apparatus of claim 1 , further comprising a dryer that dries the sensor target area.

12. The electroplating apparatus of claim 11 , further comprising a controller having executable instructions to dry the sensor target area prior to detecting the presence or absence of unwanted metal deposits using the plating sensor.

13. The electroplating apparatus of claim 1 , wherein the substrate holder is rotatable with respect to the plating sensor.

14. The electroplating apparatus of claim 1 , further comprising an inlet configured to deliver fluid to the sensor target area.

15. The electroplating apparatus of claim 14 , further comprising a controller having executable instructions to wet the sensor target area with fluid after the plating sensor is used to detect the presence or absence of unwanted metal deposits in the sensor target area and before the electroplating apparatus is used to electroplate on a new substrate.

16. A method of detecting the presence or absence of an unwanted metal deposit on a substrate holder of an electroplating apparatus, the method comprising:
positioning the substrate holder at a detection position, the substrate holder comprising a sensor target area;
aligning a plating sensor and the sensor target area using an alignment fixture that fits over the substrate holder, the alignment fixture comprising a first portion and a second portion, wherein the first and second portions are distinguishable from one another with respect to a property measured by the plating sensor; and
operating the plating sensor comprising a light source to detect the presence or absence of the unwanted metal deposit in the sensor target area, wherein the plating sensor and the sensor target area are positioned on opposite sides of the electroplating apparatus such that a line of sight of the plating sensor extends across the electroplating apparatus.

Assignees

• Lam Res Corp

Inventors

• Arora Rajan
• Herr Jared
• Marchetti Jason Daniel
• Mayer Steven T
• Zibrida James R

Classifications

• G01N27/9046

  by analysing electrical signals · CPC title

• G01N21/9501

  Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20) · CPC title

• G01N21/94

  Investigating contamination, e.g. dust (G01N21/85 takes precedence) · CPC title

• C25D17/004

  Sealing devices · CPC title

• G01N21/9515 Primary

  Objects of complex shape, e.g. examined with use of a surface follower device (measuring contours and curvatures G01B11/24) · CPC title